Werner Reiss

Person

Raubling, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Soldering a conductor to an aluminum metallization
- Patent number 11,450,642
- Issue date Sep 20, 2022
- Infineon Technologies AG
- Edmund Riedl
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Soldering a conductor to an aluminum metallization
- Patent number 10,896,893
- Issue date Jan 19, 2021
- Infineon Technologies AG
- Edmund Riedl
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Soldering a conductor to an aluminum metallization
- Patent number 10,892,247
- Issue date Jan 12, 2021
- Infineon Technologies AG
- Edmund Riedl
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package with air cavity
- Patent number 10,777,536
- Issue date Sep 15, 2020
- Infineon Technologies AG
- Chau Fatt Chiang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Soldering a conductor to an aluminum metallization
- Patent number 10,615,145
- Issue date Apr 7, 2020
- Infineon Technologies AG
- Edmund Riedl
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Radio frequency device packages and methods of formation thereof
- Patent number 10,505,255
- Issue date Dec 10, 2019
- Infineon Technologies AG
- Ashutosh Baheti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio frequency device packages and methods of formation thereof
- Patent number 9,935,065
- Issue date Apr 3, 2018
- Infineon Technologies AG
- Ashutosh Baheti
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SOLDERING A CONDUCTOR TO AN ALUMINUM METALLIZATION
- Publication number 20210118843
- Publication date Apr 22, 2021
- INFINEON TECHNOLOGIES AG
- Edmund Riedl
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDERING A CONDUCTOR TO AN ALUMINUM METALLIZATION
- Publication number 20200243480
- Publication date Jul 30, 2020
- INFINEON TECHNOLOGIES AG
- Edmund Riedl
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDERING A CONDUCTOR TO AN ALUMINUM METALLIZATION
- Publication number 20200219841
- Publication date Jul 9, 2020
- INFINEON TECHNOLOGIES AG
- Edmund Riedl
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor Package Having a Laser-Activatable Mold Compound
- Publication number 20200185293
- Publication date Jun 11, 2020
- Stefan Schmalzl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package with Air Cavity
- Publication number 20190181120
- Publication date Jun 13, 2019
- INFINEON TECHNOLOGIES AG
- Chau Fatt Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDERING A CONDUCTOR TO AN ALUMINUM METALLIZATION
- Publication number 20190035764
- Publication date Jan 31, 2019
- INFINEON TECHNOLOGIES AG
- Edmund Riedl
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Radio Frequency Device Packages and Methods of Formation Thereof
- Publication number 20180219272
- Publication date Aug 2, 2018
- INFINEON TECHNOLOGIES AG
- Ashutosh Baheti
- H01 - BASIC ELECTRIC ELEMENTS

Werner Reiss

Person

Patents Grantslast 30 patents

Soldering a conductor to an aluminum metallization

Soldering a conductor to an aluminum metallization

Soldering a conductor to an aluminum metallization

Semiconductor package with air cavity

Soldering a conductor to an aluminum metallization

Radio frequency device packages and methods of formation thereof

Radio frequency device packages and methods of formation thereof

Patents Applicationslast 30 patents

SOLDERING A CONDUCTOR TO AN ALUMINUM METALLIZATION

SOLDERING A CONDUCTOR TO AN ALUMINUM METALLIZATION

SOLDERING A CONDUCTOR TO AN ALUMINUM METALLIZATION

Semiconductor Package Having a Laser-Activatable Mold Compound

Semiconductor Package with Air Cavity

SOLDERING A CONDUCTOR TO AN ALUMINUM METALLIZATION

Radio Frequency Device Packages and Methods of Formation Thereof