Werner Robl

Person

Regensburg, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Electronic device, electronic module and methods for fabricating th...
- Patent number 11,615,963
- Issue date Mar 28, 2023
- Infineon Technologies AG
- Paul Frank
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device power metallization layer with stress-relievin...
- Patent number 11,276,624
- Issue date Mar 15, 2022
- Infineon Technologies Austria AG
- Michael Nelhiebel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of forming the semiconductor device
- Patent number 11,171,049
- Issue date Nov 9, 2021
- Infineon Technologies AG
- Werner Robl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device, electronic module and methods for fabricating th...
- Patent number 10,741,402
- Issue date Aug 11, 2020
- Infineon Technologies AG
- Paul Frank
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrolyte, method of forming a copper layer and method of forming...
- Patent number 10,648,096
- Issue date May 12, 2020
- Infineon Technologies AG
- Werner Robl
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Semiconductor device having a copper element and method of forming...
- Patent number 10,446,469
- Issue date Oct 15, 2019
- Infineon Technologies AG
- Thomas Detzel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-organizing barrier layer disposed between a metallization laye...
- Patent number 10,332,793
- Issue date Jun 25, 2019
- Infineon Technologies Austria AG
- Werner Robl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for making same
- Patent number 9,425,146
- Issue date Aug 23, 2016
- Infineon Technologies AG
- Thomas Fischer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit and method of forming an integrated circuit
- Patent number 9,418,937
- Issue date Aug 16, 2016
- Infineon Technologies AG
- Thomas Detzel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for making same
- Patent number 8,786,085
- Issue date Jul 22, 2014
- Infineon Technologies AG
- Hans-Joachim Barth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for making same
- Patent number 8,759,207
- Issue date Jun 24, 2014
- Infineon Technologies AG
- Hans-Joachim Barth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component with coreless transformer
- Patent number 8,665,054
- Issue date Mar 4, 2014
- Infineon Technologies Austria AG
- Matthias Stecher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for processing a semiconductor wafer or die, and particle de...
- Patent number 8,338,317
- Issue date Dec 25, 2012
- Infineon Technologies AG
- Manfred Engelhardt
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Device fabricated using an electroplating process
- Patent number 8,334,202
- Issue date Dec 18, 2012
- Infineon Technologies AG
- Jens Pohl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for making same
- Patent number 8,330,274
- Issue date Dec 11, 2012
- Infineon Technologies AG
- Hans-Joachim Barth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for making same
- Patent number 8,148,257
- Issue date Apr 3, 2012
- Infineon Technologies AG
- Hans-Joachim Barth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including conductive element
- Patent number 8,072,071
- Issue date Dec 6, 2011
- Infineon Technologies AG
- Rainer Steiner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Spin device
- Patent number 7,974,120
- Issue date Jul 5, 2011
- Infineon Technologies AG
- Gerhard Poeppel
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Method of making an integrated circuit including electrodeposition...
- Patent number 7,909,978
- Issue date Mar 22, 2011
- Infineon Technologies AG
- Johannes Lodermeyer
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Device Power Metallization Layer with Stress-Relievin...
- Publication number 20210183732
- Publication date Jun 17, 2021
- Michael Nelhiebel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE, ELECTRONIC MODULE AND METHODS FOR FABRICATING TH...
- Publication number 20200343094
- Publication date Oct 29, 2020
- INFINEON TECHNOLOGIES AG
- Paul Frank
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF FORMING THE SEMICONDUCTOR DEVICE
- Publication number 20190267283
- Publication date Aug 29, 2019
- Infineon Technologies Austria AG
- Werner Robl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES COMPRISING METALLIZATIONS COMPOSED OF POROUS...
- Publication number 20190221533
- Publication date Jul 18, 2019
- INFINEON TECHNOLOGIES AG
- Horst THEUSS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE, ELECTRONIC MODULE AND METHODS FOR FABRICATING TH...
- Publication number 20180082848
- Publication date Mar 22, 2018
- INFINEON TECHNOLOGIES AG
- Paul Frank
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ORGANIZING BARRIER LAYER DISPOSED BETWEEN A METALLIZATION LAYE...
- Publication number 20170154813
- Publication date Jun 1, 2017
- Infineon Technologies Austria AG
- Werner Robl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR MAKING SAME
- Publication number 20160343662
- Publication date Nov 24, 2016
- INFINEON TECHNOLOGIES AG
- Thomas Fischer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Having a Copper Element and Method of Forming...
- Publication number 20160329263
- Publication date Nov 10, 2016
- INFINEON TECHNOLOGIES AG
- Thomas Detzel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROLYTE, METHOD OF FORMING A COPPER LAYER AND METHOD OF FORMING...
- Publication number 20160168739
- Publication date Jun 16, 2016
- INFINEON TECHNOLOGIES AG
- Werner ROBL
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Porous Metal Coating
- Publication number 20140242374
- Publication date Aug 28, 2014
- INFINEON TECHNOLOGIES AG
- Johann Strasser
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR MAKING SAME
- Publication number 20130309864
- Publication date Nov 21, 2013
- Infineon Technologies AG
- Hans-Joachim BARTH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Component with Coreless Transformer
- Publication number 20130278372
- Publication date Oct 24, 2013
- Infineon Technologies Austria AG
- Matthias Stecher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit and Method of Forming an Integrated Circuit
- Publication number 20130147047
- Publication date Jun 13, 2013
- INFINEON TECHNOLOGIES AG
- Thomas Detzel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR MAKING SAME
- Publication number 20130062770
- Publication date Mar 14, 2013
- Infineon Technologies AG
- Hans-Joachim BARTH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PROCESSING A SEMICONDUCTOR WAFER OR DIE, AND PARTICLE DE...
- Publication number 20120256323
- Publication date Oct 11, 2012
- INFINEON TECHNOLOGIES AG
- Manfred Engelhardt
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR MAKING SAME
- Publication number 20120080791
- Publication date Apr 5, 2012
- Hans-Joachim BARTH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR MAKING SAME
- Publication number 20120074572
- Publication date Mar 29, 2012
- Thomas FISCHER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR MAKING SAME
- Publication number 20120074574
- Publication date Mar 29, 2012
- Hans-Joachim BARTH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Fabricating a Semiconductor Chip Package and Semiconduct...
- Publication number 20110291256
- Publication date Dec 1, 2011
- Rainer Steiner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE FABRICATED USING AN ELECTROPLATING PROCESS
- Publication number 20110101532
- Publication date May 5, 2011
- INFINEON TECHNOLOGIES AG
- Jens Pohl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING CONDUCTIVE ELEMENT
- Publication number 20100207272
- Publication date Aug 19, 2010
- INFINEON TECHNOLOGIES AG
- Rainer Steiner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Spin Device
- Publication number 20100188905
- Publication date Jul 29, 2010
- Gerhard Poeppel
- B82 - NANO-TECHNOLOGY
Information Patent Application
METHOD OF MAKING AN INTEGRATED CIRCUIT INCLUDING ELECTRODEPOSITION...
- Publication number 20080257743
- Publication date Oct 23, 2008
- INFINEON TECHNOLOGIES AG
- Johannes Lodermeyer
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD OF MAKING AN INTEGRATED CIRCUIT INCLUDING ELECTRODEPOSITION...
- Publication number 20080257744
- Publication date Oct 23, 2008
- INFINEON TECHNOLOGIES AG
- Johannes Lodermeyer
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Nitride and polysilicon interface with titanium layer
- Publication number 20060001162
- Publication date Jan 5, 2006
- Ronald J. Schutz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for improving the electrical resistance of con...
- Publication number 20040155268
- Publication date Aug 12, 2004
- Infineon Technologies North America Corp.
- Werner Robl
- H01 - BASIC ELECTRIC ELEMENTS

Werner Robl

Person

Patents Grantslast 30 patents

Electronic device, electronic module and methods for fabricating th...

Semiconductor device power metallization layer with stress-relievin...

Semiconductor device and a method of forming the semiconductor device

Electronic device, electronic module and methods for fabricating th...

Electrolyte, method of forming a copper layer and method of forming...

Semiconductor device having a copper element and method of forming...

Self-organizing barrier layer disposed between a metallization laye...

Semiconductor structure and method for making same

Integrated circuit and method of forming an integrated circuit

Semiconductor structure and method for making same

Semiconductor structure and method for making same

Semiconductor component with coreless transformer

Method for processing a semiconductor wafer or die, and particle de...

Device fabricated using an electroplating process

Semiconductor structure and method for making same

Semiconductor structure and method for making same

Semiconductor device including conductive element

Spin device

Method of making an integrated circuit including electrodeposition...

Patents Applicationslast 30 patents

Semiconductor Device Power Metallization Layer with Stress-Relievin...

ELECTRONIC DEVICE, ELECTRONIC MODULE AND METHODS FOR FABRICATING TH...

SEMICONDUCTOR DEVICE AND A METHOD OF FORMING THE SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICES COMPRISING METALLIZATIONS COMPOSED OF POROUS...

ELECTRONIC DEVICE, ELECTRONIC MODULE AND METHODS FOR FABRICATING TH...

SELF-ORGANIZING BARRIER LAYER DISPOSED BETWEEN A METALLIZATION LAYE...

SEMICONDUCTOR STRUCTURE AND METHOD FOR MAKING SAME

Semiconductor Device Having a Copper Element and Method of Forming...

ELECTROLYTE, METHOD OF FORMING A COPPER LAYER AND METHOD OF FORMING...

Porous Metal Coating

SEMICONDUCTOR STRUCTURE AND METHOD FOR MAKING SAME

Semiconductor Component with Coreless Transformer

Integrated Circuit and Method of Forming an Integrated Circuit

SEMICONDUCTOR STRUCTURE AND METHOD FOR MAKING SAME

METHOD FOR PROCESSING A SEMICONDUCTOR WAFER OR DIE, AND PARTICLE DE...

SEMICONDUCTOR STRUCTURE AND METHOD FOR MAKING SAME

SEMICONDUCTOR STRUCTURE AND METHOD FOR MAKING SAME

SEMICONDUCTOR STRUCTURE AND METHOD FOR MAKING SAME

Method for Fabricating a Semiconductor Chip Package and Semiconduct...

DEVICE FABRICATED USING AN ELECTROPLATING PROCESS

SEMICONDUCTOR DEVICE INCLUDING CONDUCTIVE ELEMENT

Spin Device

METHOD OF MAKING AN INTEGRATED CIRCUIT INCLUDING ELECTRODEPOSITION...

METHOD OF MAKING AN INTEGRATED CIRCUIT INCLUDING ELECTRODEPOSITION...

Nitride and polysilicon interface with titanium layer

Method and apparatus for improving the electrical resistance of con...