Wesley D. Mc Cullough

Follow

Person

Santa Clara, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Distributed semiconductor die and package architecture
- Patent number 11,257,804
- Issue date Feb 22, 2022
- Intel Corporation
- Wilfred Gomes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Functionally redundant semiconductor dies and package
- Patent number 11,127,712
- Issue date Sep 21, 2021
- Intel Corporation
- Wilfred Gomes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Distributed semiconductor die and package architecture
- Patent number 10,685,947
- Issue date Jun 16, 2020
- Intel Corporation
- Wilfred Gomes
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DISTRIBUTED SEMICONDUCTOR DIE AND PACKAGE ARCHITECTURE
- Publication number 20220139896
- Publication date May 5, 2022
- Intel Corporation
- WILFRED GOMES
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FUNCTIONALLY REDUNDANT SEMICONDUCTOR DIES AND PACKAGE
- Publication number 20210375825
- Publication date Dec 2, 2021
- Intel Corporation
- Wilfred Gomes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISTRIBUTED SEMICONDUCTOR DIE AND PACKAGE ARCHITECTURE
- Publication number 20200312833
- Publication date Oct 1, 2020
- Intel Corporation
- WILFRED GOMES
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISTRIBUTED SEMICONDUCTOR DIE AND PACKAGE ARCHITECTURE
- Publication number 20190221556
- Publication date Jul 18, 2019
- WILFRED GOMES
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FUNCTIONALLY REDUNDANT SEMICONDUCTOR DIES AND PACKAGE
- Publication number 20190206834
- Publication date Jul 4, 2019
- Intel Corporation
- Wilfred Gomes
- H01 - BASIC ELECTRIC ELEMENTS