Weston BERTRAND

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Tempe, AZ, US

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Patents Grantslast 30 patents

Information Patent Grant
Enhanced base die heat path using through-silicon vias
- Patent number 12,266,589
- Issue date Apr 1, 2025
- Intel Corporation
- Weston Bertrand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced base die heat path using through-silicon vias
- Patent number 12,057,369
- Issue date Aug 6, 2024
- Intel Corporation
- Weston Bertrand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced base die heat path using through-silicon vias
- Patent number 11,854,935
- Issue date Dec 26, 2023
- Intel Corporation
- Weston Bertrand
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ENHANCED BASE DIE HEAT PATH USING THROUGH-SILICON VIAS
- Publication number 20240282667
- Publication date Aug 22, 2024
- Intel Corporation
- Weston BERTRAND
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENHANCED BASE DIE HEAT PATH USING THROUGH-SILICON VIAS
- Publication number 20230128903
- Publication date Apr 27, 2023
- Intel Corporation
- Weston BERTRAND
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER HEAT SPREADER
- Publication number 20210272885
- Publication date Sep 2, 2021
- Intel Corporation
- Kyle ARRINGTON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENHANCED BASE DIE HEAT PATH USING THROUGH-SILICON VIAS
- Publication number 20210257277
- Publication date Aug 19, 2021
- Intel Corporation
- Weston BERTRAND
- H01 - BASIC ELECTRIC ELEMENTS