Wilber T. Layton

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San Diego, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Method of fabricating an integrated circuit package having a liquid...
- Patent number 5,658,831
- Issue date Aug 19, 1997
- Unisys Corporation
- Wilber Terry Layton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package having a liquid metal-aluminum/copper joint
- Patent number 5,459,352
- Issue date Oct 17, 1995
- Unisys Corporation
- Wilber T. Layton
- H01 - BASIC ELECTRIC ELEMENTS