Wilfried Scherer

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Rieden, DE

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Patents Grantslast 30 patents

Information Patent Grant
Connection of a connection wire and a connection element
- Patent number 11,522,302
- Issue date Dec 6, 2022
- TDK ELECTRONICS AG
- Wilfried Scherer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip inductance
- Patent number 6,249,208
- Issue date Jun 19, 2001
- Siemens Matsushita Components GmbH & Co. KG
- Gerhard Proks
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for bonding an insulated wire element on a contact
- Patent number 4,712,723
- Issue date Dec 15, 1987
- Siemens Aktiengesellschaft
- Helmut Moll
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Connection of a Connection Wire and a Connection Element
- Publication number 20200220276
- Publication date Jul 9, 2020
- TDK Electronics AG
- Wilfried Scherer
- H01 - BASIC ELECTRIC ELEMENTS