WILHELM LAPOINTE

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RICHMONT, VT, US

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Patents Grantslast 30 patents

Information Patent Grant
Apparatus and method for semiconductor wafer bumping via injection...
- Patent number 7,790,596
- Issue date Sep 7, 2010
- Suss Microtec AG
- Hale Johnson
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
APPARATUS AND METHOD FOR SEMICONDUCTOR WAFER BUMPING VIA INJECTION...
- Publication number 20080188070
- Publication date Aug 7, 2008
- SUSS MICROTEC AG
- HALE JOHNSON
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR