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William Andrew Nevin
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Portadown, GB
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Patents Grants
last 30 patents
Information
Patent Grant
Method for forming a filled trench in a semiconductor layer of a se...
Patent number
7,122,416
Issue date
Oct 17, 2006
Analog Devices, Inc.
William Andrew Nevin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of forming a cavity and SOI in a semiconductor substrate
Patent number
6,955,988
Issue date
Oct 18, 2005
Analog Devices, Inc.
William Andrew Nevin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Composite semiconductor wafer and a method for forming the composit...
Patent number
6,841,848
Issue date
Jan 11, 2005
Analog Devices, Inc.
Cormac John MacNamara
B81 - MICRO-STRUCTURAL TECHNOLOGY
Patents Applications
last 30 patents
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Patent Application
Method for bonding a pair of silicon wafers together, and a semicon...
Publication number
20080026230
Publication date
Jan 31, 2008
William Andrew Nevin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method for bonding a pair of silicon wafers together, and a semicon...
Publication number
20060030123
Publication date
Feb 9, 2006
William Andrew Nevin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Integrated circuit with impurity barrier
Publication number
20050255677
Publication date
Nov 17, 2005
Jason W. Weigold
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
Method for bonding a pair of silicon wafers together, and a semicon...
Publication number
20050048737
Publication date
Mar 3, 2005
William Andrew Nevin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
COMPOSITE SEMICONDUCTOR WAFER AND A METHOD FOR FORMING THE COMPOSIT...
Publication number
20040245605
Publication date
Dec 9, 2004
Cormac John MacNamara
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
Method for bonding a pair of silicon wafers together, and a semicon...
Publication number
20030148592
Publication date
Aug 7, 2003
William Andrew Nevin
H01 - BASIC ELECTRIC ELEMENTS