William B. Rife

Person

Greenville, RI, US

People

Patents Grantslast 30 patents

Information Patent Grant
Multi-device heat sink assembly
- Patent number 6,252,774
- Issue date Jun 26, 2001
- Chip Coolers, Inc.
- William B. Rife
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat sink assembly with snap-in legs
- Patent number 6,075,699
- Issue date Jun 13, 2000
- Chip Coolers, Inc.
- William B. Rife
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat sink assembly with multiple pressure capability
- Patent number 6,014,315
- Issue date Jan 11, 2000
- Chip Coolers, Inc.
- Kevin A. McCullough
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat sink assembly with snap-in cover plate having multiple pressur...
- Patent number 5,945,736
- Issue date Aug 31, 1999
- Chip Coolers, Inc.
- William B. Rife
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat sink assembly with adjustable mounting clip
- Patent number 5,825,622
- Issue date Oct 20, 1998
- Chip Coolers, Inc.
- William B. Rife
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat sink assembly with height adjustable mounting clip
- Patent number 5,774,335
- Issue date Jun 30, 1998
- Chip Coolers, Inc.
- Rodney H. Pare
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat sink assembly for solid state devices
- Patent number 5,397,919
- Issue date Mar 14, 1995
- Square Head, Inc.
- Peter D. Tata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat sink assembly for solid state devices
- Patent number 5,313,099
- Issue date May 17, 1994
- Square Head, Inc.
- Peter D. Tata
- H01 - BASIC ELECTRIC ELEMENTS

William B. Rife

Person

Patents Grantslast 30 patents

Multi-device heat sink assembly

Heat sink assembly with snap-in legs

Heat sink assembly with multiple pressure capability

Heat sink assembly with snap-in cover plate having multiple pressur...

Heat sink assembly with adjustable mounting clip

Heat sink assembly with height adjustable mounting clip

Heat sink assembly for solid state devices

Heat sink assembly for solid state devices