William B. Weiser

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Meridian, ID, US

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Patents Grantslast 30 patents

Information Patent Grant
Polygonal BGA semiconductor package
- Patent number 11,004,778
- Issue date May 11, 2021
- Marvell Israel (M.I.S.L) Ltd.
- Dan Azeroual
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing an on-board wireless module architecture
- Patent number 9,980,391
- Issue date May 22, 2018
- Marvell International Ltd.
- William B. Weiser
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interposer based capacitors for semiconductor packaging
- Patent number 8,624,365
- Issue date Jan 7, 2014
- Marvell International Ltd.
- William B. Weiser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low power pad
- Patent number 8,564,335
- Issue date Oct 22, 2013
- Marvell International Ltd
- William B. Weiser
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Regulating an operating condition of an integrated circuit to compe...
- Patent number 8,164,390
- Issue date Apr 24, 2012
- Marvell International Ltd.
- Randall D. Briggs
- H03 - BASIC ELECTRONIC CIRCUITRY

Patents Applicationslast 30 patents

Information Patent Application
Electronic device cradle organizer
- Publication number 20050018839
- Publication date Jan 27, 2005
- William Bruce Weiser
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER