William Becia

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Boise, ID, US

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Patents Grantslast 30 patents

Information Patent Grant
Method, device and system for semiconductor wafer transfer
- Patent number 6,817,823
- Issue date Nov 16, 2004
- Marian Corporation
- Edward R. Fix
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple stage wet processing platform and method of use
- Patent number 6,138,694
- Issue date Oct 31, 2000
- SCP Global Technologies
- Eric T. Hansen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple stage wet processing chamber
- Patent number 6,136,724
- Issue date Oct 24, 2000
- SCP Global Technologies
- Eric T. Hansen
- B08 - CLEANING

Patents Applicationslast 30 patents

Information Patent Application
Material supply device
- Publication number 20070248385
- Publication date Oct 25, 2007
- Patrick Dougherty
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Method, device and system for semiconductor wafer transfer
- Publication number 20030057130
- Publication date Mar 27, 2003
- Edward R. Fix
- H01 - BASIC ELECTRIC ELEMENTS