William Boyd Rogers

Person

Raleigh, NC, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method of making fully molded peripheral package on package device
- Patent number 10,672,624
- Issue date Jun 2, 2020
- Deca Technologies Inc.
- Christopher M. Scanlan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device processing method for material removal
- Patent number 10,600,652
- Issue date Mar 24, 2020
- Deca Technologies Inc.
- Timothy L. Olson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Two step method of rapid curing a semiconductor polymer layer
- Patent number 10,204,803
- Issue date Feb 12, 2019
- Deca Technologies Inc.
- William Boyd Rogers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fully molded peripheral package on package device
- Patent number 10,050,004
- Issue date Aug 14, 2018
- Deca Technologies Inc.
- Christopher M. Scanlan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device processing method for material removal
- Patent number 9,640,495
- Issue date May 2, 2017
- Deca Technologies Inc.
- Timothy L. Olson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fully molded peripheral package on package device
- Patent number 9,613,830
- Issue date Apr 4, 2017
- Deca Technologies Inc.
- Christopher M. Scanlan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Two step method of rapid curing a semiconductor polymer layer
- Patent number 9,159,547
- Issue date Oct 13, 2015
- Deca Technologies Inc.
- William Boyd Rogers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electroplating methods including maintaining a determined electropl...
- Patent number 6,793,792
- Issue date Sep 21, 2004
- Unitive International Limited Curaco
- Curtis Grant Jones
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FULLY MOLDED PERIPHERAL PACKAGE ON PACKAGE DEVICE
- Publication number 20180330966
- Publication date Nov 15, 2018
- DECA TECHNOLOGIES INC
- Christopher M. Scanlan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PROCESSING METHOD FOR MATERIAL REMOVAL
- Publication number 20170221719
- Publication date Aug 3, 2017
- DECA TECHNOLOGIES INC
- Timothy L. Olson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FULLY MOLDED PERIPHERAL PACKAGE ON PACKAGE DEVICE
- Publication number 20170221830
- Publication date Aug 3, 2017
- DECA TECHNOLOGIES INC
- Christopher M. Scanlan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FULLY MOLDED PERIPHERAL PACKAGE ON PACKAGE DEVICE
- Publication number 20170148755
- Publication date May 25, 2017
- DECA TECHNOLOGIES INC
- Christopher M. Scanlan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PROCESSING METHOD FOR MATERIAL REMOVAL
- Publication number 20170012009
- Publication date Jan 12, 2017
- DECA TECHNOLOGIES INC
- Timothy L. Olson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FULLY MOLDED PERIPHERAL PACKAGE ON PACKAGE DEVICE
- Publication number 20160260682
- Publication date Sep 8, 2016
- DECA TECHNOLOGIES INC
- Christopher M. Scanlan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TWO STEP METHOD OF RAPID CURING A SEMICONDUCTOR POLYMER LAYER
- Publication number 20160027666
- Publication date Jan 28, 2016
- DECA TECHNOLOGIES INC
- William Boyd Rogers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TWO STEP METHOD OF RAPID CURING A SEMICONDUCTOR POLYMER LAYER
- Publication number 20150079805
- Publication date Mar 19, 2015
- DECA TECHNOLOGIES INC
- William Boyd Rogers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electroplating methods including maintaining a determined electropl...
- Publication number 20020092771
- Publication date Jul 18, 2002
- Curtis Grant Jones
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

William Boyd Rogers

Person

Patents Grantslast 30 patents

Method of making fully molded peripheral package on package device

Semiconductor device processing method for material removal

Two step method of rapid curing a semiconductor polymer layer

Fully molded peripheral package on package device

Semiconductor device processing method for material removal

Fully molded peripheral package on package device

Two step method of rapid curing a semiconductor polymer layer

Electroplating methods including maintaining a determined electropl...

Patents Applicationslast 30 patents

FULLY MOLDED PERIPHERAL PACKAGE ON PACKAGE DEVICE

SEMICONDUCTOR DEVICE PROCESSING METHOD FOR MATERIAL REMOVAL

FULLY MOLDED PERIPHERAL PACKAGE ON PACKAGE DEVICE

FULLY MOLDED PERIPHERAL PACKAGE ON PACKAGE DEVICE

SEMICONDUCTOR DEVICE PROCESSING METHOD FOR MATERIAL REMOVAL

FULLY MOLDED PERIPHERAL PACKAGE ON PACKAGE DEVICE

TWO STEP METHOD OF RAPID CURING A SEMICONDUCTOR POLYMER LAYER

TWO STEP METHOD OF RAPID CURING A SEMICONDUCTOR POLYMER LAYER

Electroplating methods including maintaining a determined electropl...