William Brezinski

Person

Beaverton, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Interconnect structures and methods of fabrication
- Patent number 11,887,887
- Issue date Jan 30, 2024
- Intel Corporation
- Manish Chandhok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and structures for improved electrical contact between bond...
- Patent number 11,784,123
- Issue date Oct 10, 2023
- Intel Corporation
- Richard Vreeland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metallization barrier structures for bonded integrated circuit inte...
- Patent number 11,532,558
- Issue date Dec 20, 2022
- Intel Corporation
- Carl Naylor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures and methods of fabrication
- Patent number 11,404,307
- Issue date Aug 2, 2022
- Intel Corporation
- Manish Chandhok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and structures for improved electrical contact between bond...
- Patent number 11,289,421
- Issue date Mar 29, 2022
- Intel Corporation
- Richard Vreeland
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CONFORMAL COATINGS WITH SPATIALLY DEFINED SURFACE ENERGIES FOR DIE-...
- Publication number 20250112155
- Publication date Apr 3, 2025
- Intel Corporation
- Kimin Jun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE LAYER TRANSFER
- Publication number 20250105046
- Publication date Mar 27, 2025
- Intel Corporation
- Adel Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURES AND METHODS OF FABRICATION
- Publication number 20220336267
- Publication date Oct 20, 2022
- Intel Corporation
- Manish Chandhok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS & STRUCTURES FOR IMPROVED ELECTRICAL CONTACT BETWEEN BONDED...
- Publication number 20220181251
- Publication date Jun 9, 2022
- Intel Corporation
- Richard Vreeland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METALLIZATION BARRIER STRUCTURES FOR BONDED INTEGRATED CIRCUIT INTE...
- Publication number 20210098387
- Publication date Apr 1, 2021
- Intel Corporation
- Carl Naylor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS & STRUCTURES FOR IMPROVED ELECTRICAL CONTACT BETWEEN BONDED...
- Publication number 20210098359
- Publication date Apr 1, 2021
- Intel Corporation
- Richard Vreeland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NTERCONNECT STRUCTURES AND METHODS OF FABRICATION
- Publication number 20210098360
- Publication date Apr 1, 2021
- Intel Corporation
- Manish Chandhok
- H01 - BASIC ELECTRIC ELEMENTS

William Brezinski

Person

Patents Grantslast 30 patents

Interconnect structures and methods of fabrication

Methods and structures for improved electrical contact between bond...

Metallization barrier structures for bonded integrated circuit inte...

Interconnect structures and methods of fabrication

Methods and structures for improved electrical contact between bond...

Patents Applicationslast 30 patents

CONFORMAL COATINGS WITH SPATIALLY DEFINED SURFACE ENERGIES FOR DIE-...

SELECTIVE LAYER TRANSFER

INTERCONNECT STRUCTURES AND METHODS OF FABRICATION

METHODS & STRUCTURES FOR IMPROVED ELECTRICAL CONTACT BETWEEN BONDED...

METALLIZATION BARRIER STRUCTURES FOR BONDED INTEGRATED CIRCUIT INTE...

METHODS & STRUCTURES FOR IMPROVED ELECTRICAL CONTACT BETWEEN BONDED...

NTERCONNECT STRUCTURES AND METHODS OF FABRICATION