William C. Stermer JR.

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Chandler, AZ, US

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Patents Grantslast 30 patents

Information Patent Grant
Electronic devices with cavity-type, permeable material filled pack...
- Patent number 9,510,495
- Issue date Nov 29, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Stephen R. Hooper
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectronic packages including patterned die attach material an...
- Patent number 8,962,389
- Issue date Feb 24, 2015
- FREESCALE SEMICONDUCTOR, INC.
- William C. Stermer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrated circuit package and method of forming the same
- Patent number 8,890,308
- Issue date Nov 18, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Stephen R. Hooper
- B60 - VEHICLES IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
MICROELECTRONIC PACKAGES INCLUDING PATTERNED DIE ATTACH MATERIAL AN...
- Publication number 20140353772
- Publication date Dec 4, 2014
- William C. Stermer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ELECTRONIC DEVICES WITH CAVITY-TYPE, PERMEABLE MATERIAL FILLED PACK...
- Publication number 20140146509
- Publication date May 29, 2014
- STEPHEN R. HOOPER
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING THE SAME
- Publication number 20130264692
- Publication date Oct 10, 2013
- FREESCALE SEMICONDUCTOR, INC.
- Stephen R. Hooper
- B60 - VEHICLES IN GENERAL