William C. Ward

Person

Burlington, VT, US

People

Patents Grantslast 30 patents

Information Patent Grant
Tape application platform and processes therefor
- Patent number 6,043,557
- Issue date Mar 28, 2000
- Douglas Wallace Phelps
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tape application platform and processes therefor
- Patent number 5,889,320
- Issue date Mar 30, 1999
- Douglas Wallace Phelps
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tape application platform and processes therefor
- Patent number 5,696,032
- Issue date Dec 9, 1997
- Douglas Wallace Phelps
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tape application platform and processes therefor
- Patent number 5,661,336
- Issue date Aug 26, 1997
- Douglas Wallace Phelps
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Planarized thin film surface covered wire bonded semiconductor package
- Patent number 5,151,559
- Issue date Sep 29, 1992
- International Business Machines Corporation
- H. Ward Conru
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a planarized thin film covered wire bonded semicon...
- Patent number 5,086,018
- Issue date Feb 4, 1992
- International Business Machines Corporation
- H. Ward Conru
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with ground plane
- Patent number 4,965,654
- Issue date Oct 23, 1990
- International Business Machines Corporation
- Friedrich A. Karner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 4,916,519
- Issue date Apr 10, 1990
- International Business Machines Corporation
- William C. Ward
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of bonding gold or gold alloy wire to lead tin solder
- Patent number 4,907,734
- Issue date Mar 13, 1990
- International Business Machines Corporation
- H. Ward Conru
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat dissipation package for integrated circuits
- Patent number 4,878,108
- Issue date Oct 31, 1989
- International Business Machines Corporation
- Douglas W. Phelps
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package semiconductor chip
- Patent number 4,862,245
- Issue date Aug 29, 1989
- International Business Machines Corporation
- Richard P. Pashby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Peripheral/area wire bonding technique
- Patent number 4,796,078
- Issue date Jan 3, 1989
- International Business Machines Corporation
- Douglas W. Phelps
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Welded wire cooling
- Patent number 4,714,953
- Issue date Dec 22, 1987
- International Business Machines Corporation
- Marvin L. Buller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Highly integrated universal tape bonding
- Patent number 4,551,912
- Issue date Nov 12, 1985
- International Business Machines Corporation
- Robert Marks
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate with multiple type connections
- Patent number 4,447,857
- Issue date May 8, 1984
- International Business Machines Corporation
- Robert Marks
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Percussive arc welding
- Patent number 4,417,120
- Issue date Nov 22, 1983
- International Business Machines Corporation
- Douglas L. Lumbra
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for coating mold
- Patent number 4,281,032
- Issue date Jul 28, 1981
- International Business Machines Corporation
- Barnee M. Escott
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

William C. Ward

Person

Patents Grantslast 30 patents

Tape application platform and processes therefor

Tape application platform and processes therefor

Tape application platform and processes therefor

Tape application platform and processes therefor

Planarized thin film surface covered wire bonded semiconductor package

Method of making a planarized thin film covered wire bonded semicon...

Semiconductor package with ground plane

Semiconductor package

Method of bonding gold or gold alloy wire to lead tin solder

Heat dissipation package for integrated circuits

Package semiconductor chip

Peripheral/area wire bonding technique

Welded wire cooling

Highly integrated universal tape bonding

Substrate with multiple type connections

Percussive arc welding

Method for coating mold