William C. Weigler

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New Braunfels, TX, US

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Patents Grantslast 30 patents

Information Patent Grant
Vertical removal of excess solder from a circuit substrate
- Patent number 7,353,983
- Issue date Apr 8, 2008
- Temic Automotive of North America, Inc.
- William C. Weigler
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Adhesive assembly for a circuit board
- Patent number 7,300,820
- Issue date Nov 27, 2007
- Temic Automotive of North America, Inc.
- Jinbao Jiao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Adhesive assembly for a circuit board
- Publication number 20050208708
- Publication date Sep 22, 2005
- Jinbao Jiao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Vertical removal of excess solder from a circuit substrate
- Publication number 20050087588
- Publication date Apr 28, 2005
- William C. Weigler
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR