William Crew

Person

Portland, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Low-K SiC copper diffusion barrier films
- Patent number 7,968,436
- Issue date Jun 28, 2011
- Novellus Systems, Inc.
- Yongsik Yu
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
UV treatment for carbon-containing low-k dielectric repair in semic...
- Patent number 7,851,232
- Issue date Dec 14, 2010
- Novellus Systems, Inc.
- Bart van Schravendijk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low-k b-doped SiC copper diffusion barrier films
- Patent number 7,842,604
- Issue date Nov 30, 2010
- Novellus Systems, Inc.
- Yongsik Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low-k SiC copper diffusion barrier films
- Patent number 7,573,061
- Issue date Aug 11, 2009
- Novellus Systems, Inc.
- Yongsik Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Boron-doped SIC copper diffusion barrier films
- Patent number 7,420,275
- Issue date Sep 2, 2008
- Novellus Systems, Inc.
- Yongsik Yu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Low-k SiC copper diffusion barrier films
- Patent number 7,282,438
- Issue date Oct 16, 2007
- Novellus Systems, Inc.
- Yongsik Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low-k B-doped SiC copper diffusion barrier films
- Patent number 7,239,017
- Issue date Jul 3, 2007
- Novellus Systems, Inc.
- Yongsik Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film for copper diffusion barrier
- Patent number 7,163,889
- Issue date Jan 16, 2007
- Novellus Systems, Inc.
- Yongsik Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Strained transistor architecture and method
- Patent number 7,041,543
- Issue date May 9, 2006
- Novellus Systems, Inc.
- Bhadri Varadarajan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film for copper diffusion barrier
- Patent number 6,967,405
- Issue date Nov 22, 2005
- Yongsik Yu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
UV TREATMENT FOR CARBON-CONTAINING LOW-K DIELECTRIC REPAIR IN SEMIC...
- Publication number 20110045610
- Publication date Feb 24, 2011
- Bart van Schravendijk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UV TREATMENT FOR CARBON-CONTAINING LOW-K DIELECTRIC REPAIR IN SEMIC...
- Publication number 20100261349
- Publication date Oct 14, 2010
- Novellus Systems, Inc.
- Bart van Schravendijk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Novel film for copper diffusion barrier
- Publication number 20060019486
- Publication date Jan 26, 2006
- Novellus Systems, Inc.
- Yongsik Yu
- H01 - BASIC ELECTRIC ELEMENTS

William Crew

Person

Patents Grantslast 30 patents

Low-K SiC copper diffusion barrier films

UV treatment for carbon-containing low-k dielectric repair in semic...

Low-k b-doped SiC copper diffusion barrier films

Low-k SiC copper diffusion barrier films

Boron-doped SIC copper diffusion barrier films

Low-k SiC copper diffusion barrier films

Low-k B-doped SiC copper diffusion barrier films

Film for copper diffusion barrier

Strained transistor architecture and method

Film for copper diffusion barrier

Patents Applicationslast 30 patents

UV TREATMENT FOR CARBON-CONTAINING LOW-K DIELECTRIC REPAIR IN SEMIC...

UV TREATMENT FOR CARBON-CONTAINING LOW-K DIELECTRIC REPAIR IN SEMIC...

Novel film for copper diffusion barrier