William D. Higdon

Person

Greentown, IN, US

People

Patents Grantslast 30 patents

Information Patent Grant
Flip-chip interconnected with increased current-carrying capability
- Patent number 6,822,327
- Issue date Nov 23, 2004
- Delphi Technologies, Inc.
- Pankaj Mithal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface bumping method and structure formed thereby
- Patent number 6,375,062
- Issue date Apr 23, 2002
- Delphi Technologies, Inc.
- William D. Higdon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of solder bumping a circuit component
- Patent number 6,281,106
- Issue date Aug 28, 2001
- Delphi Technologies, Inc.
- William David Higdon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface mount circuit device and solder bumping method therefor
- Patent number 6,251,501
- Issue date Jun 26, 2001
- Delphi Technologies, Inc.
- William David Higdon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder bump transfer device for flip chip integrated circuit devices
- Patent number 5,607,099
- Issue date Mar 4, 1997
- Delco Electronics Corporation
- Shing Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solderable contacts for flip chip integrated circuit devices
- Patent number 5,547,740
- Issue date Aug 20, 1996
- Delco Electronics Corporation
- William D. Higdon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single substrate microwave radar transceiver including flip-chip in...
- Patent number 5,115,245
- Issue date May 19, 1992
- Hughes Aircraft Company
- Cheng P. Wen
- G01 - MEASURING TESTING
Information Patent Grant
Flip-chip MMIC oscillator assembly with off-chip coplanar waveguide...
- Patent number 5,087,896
- Issue date Feb 11, 1992
- Hughes Aircraft Company
- Cheng P. Wen
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Semiconductor pressure sensor with slanted resistors
- Patent number 4,400,681
- Issue date Aug 23, 1983
- General Motors Corporation
- Ronald E. Brown
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
Integrated circuit with low-stress under-bump metallurgy
- Publication number 20070029669
- Publication date Feb 8, 2007
- Frank Stepniak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flip-chip interconnect with increased current-carrying capability
- Publication number 20050046024
- Publication date Mar 3, 2005
- DELPHI TECHNOLOGIES, INC.
- Pankaj Mithal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP-CHIP INTERCONNECT WITH INCREASED CURRENT-CARRYING CAPABILITY
- Publication number 20040251542
- Publication date Dec 16, 2004
- Pankaj Mithal
- H01 - BASIC ELECTRIC ELEMENTS

William D. Higdon

Person

Patents Grantslast 30 patents

Flip-chip interconnected with increased current-carrying capability

Surface bumping method and structure formed thereby

Method of solder bumping a circuit component

Surface mount circuit device and solder bumping method therefor

Solder bump transfer device for flip chip integrated circuit devices

Solderable contacts for flip chip integrated circuit devices

Single substrate microwave radar transceiver including flip-chip in...

Flip-chip MMIC oscillator assembly with off-chip coplanar waveguide...

Semiconductor pressure sensor with slanted resistors

Patents Applicationslast 30 patents

Integrated circuit with low-stress under-bump metallurgy

Flip-chip interconnect with increased current-carrying capability

FLIP-CHIP INTERCONNECT WITH INCREASED CURRENT-CARRYING CAPABILITY