William D. Jordan

Person

Dallas, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Solderable transistor clip and heat sink
- Patent number 5,844,312
- Issue date Dec 1, 1998
- Thermalloy, Inc.
- Howard G. Hinshaw
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stamped and formed heat sink
- Patent number 5,566,749
- Issue date Oct 22, 1996
- Thermalloy, Inc.
- William D. Jordan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for dissipating thermal energy
- Patent number 5,486,980
- Issue date Jan 23, 1996
- Thermalloy, Inc.
- William D. Jordan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat sink attachment assembly
- Patent number 5,428,897
- Issue date Jul 4, 1995
- Thermalloy, Inc.
- William D. Jordan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board component mounting device
- Patent number 5,422,789
- Issue date Jun 6, 1995
- Redpoint Thermalloy Limited
- Francis E. Fisher
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat sink attachment assembly
- Patent number 5,386,338
- Issue date Jan 31, 1995
- Thermalloy, Inc.
- William D. Jordan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Finned heat sink and method of manufacture
- Patent number 5,038,858
- Issue date Aug 13, 1991
- Thermalloy Incorporated
- William D. Jordan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method of attaching an electronic device package and...
- Patent number 4,961,125
- Issue date Oct 2, 1990
- Thermalloy Incorporated
- William D. Jordan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alignment apparatus for use in mounting electronic components and h...
- Patent number 4,847,449
- Issue date Jul 11, 1989
- Thermalloy Incorporated
- William D. Jordan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alignment apparatus for electronic device package
- Patent number 4,709,302
- Issue date Nov 24, 1987
- Thermalloy Incorporated
- William D. Jordan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fasteners for surface mounting of printed circuit board components
- Patent number 4,625,260
- Issue date Nov 25, 1986
- Thermalloy Incorporated
- William D. Jordan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat sink mounting
- Patent number 4,521,827
- Issue date Jun 4, 1985
- Thermalloy, Inc.
- William D. Jordan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting means with solderable studs
- Patent number 4,446,504
- Issue date May 1, 1984
- Thermalloy Incorporated
- William D. Jordan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat sink mounting
- Patent number 4,403,102
- Issue date Sep 6, 1983
- Thermalloy Incorporated
- William D. Jordan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat sink or similar article
- Patent number D269606
- Issue date Jul 5, 1983
- Thermalloy Incorporated
- William D. Jordan
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
Index mounting unitary heat sink apparatus with apertured base
- Patent number 4,054,901
- Issue date Oct 18, 1977
- Thermalloy, Inc.
- Steven F. Edwards
- H01 - BASIC ELECTRIC ELEMENTS

William D. Jordan

Person

Patents Grantslast 30 patents

Solderable transistor clip and heat sink

Stamped and formed heat sink

Method and apparatus for dissipating thermal energy

Heat sink attachment assembly

Printed circuit board component mounting device

Heat sink attachment assembly

Finned heat sink and method of manufacture

Apparatus and method of attaching an electronic device package and...

Alignment apparatus for use in mounting electronic components and h...

Alignment apparatus for electronic device package

Fasteners for surface mounting of printed circuit board components

Heat sink mounting

Mounting means with solderable studs

Heat sink mounting

Heat sink or similar article

Index mounting unitary heat sink apparatus with apertured base