William E. Bernier

Person

Endwell, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Silicon interposer sandwich structure for ESD, EMC, and EMC shieldi...
- Patent number 11,810,893
- Issue date Nov 7, 2023
- International Business Machines Corporation
- William Emmett Bernier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon interposer sandwich structure for ESD, EMC, and EMC shieldi...
- Patent number 11,049,841
- Issue date Jun 29, 2021
- International Business Machines Corporation
- William Emmett Bernier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flat laminate, symmetrical test structures and method of use to gau...
- Patent number 10,699,972
- Issue date Jun 30, 2020
- International Business Machines Corporation
- William E. Bernier
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Metal oxide nanofibrous materials for photodegradation of environme...
- Patent number 10,661,261
- Issue date May 26, 2020
- The Research Foundation for the State University of New York
- Wayne E. Jones
- D01 - NATURAL OR ARTIFICIAL THREADS OR FIBRES SPINNING
Information Patent Grant
Increased thermal stabilization of optical absorbers
- Patent number 10,459,121
- Issue date Oct 29, 2019
- The Research Foundation for the State University of New York
- William E. Bernier
- G02 - OPTICS
Information Patent Grant
Conductive films and devices comprised thereof
- Patent number 9,920,220
- Issue date Mar 20, 2018
- The Research Foundation of State University of New York
- William E. Bernier
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Increased thermal stabilization of optical absorbers
- Patent number 9,915,757
- Issue date Mar 13, 2018
- The Research Foundation for the State University of New York
- William E. Bernier
- G02 - OPTICS
Information Patent Grant
Flat laminate, symmetrical test structures and method of use to gau...
- Patent number 9,899,279
- Issue date Feb 20, 2018
- International Business Machines Corporation
- William E. Bernier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flat laminate, symmetrical test structures and method of use to gau...
- Patent number 8,957,531
- Issue date Feb 17, 2015
- International Business Machines Corporation
- William E. Bernier
- G01 - MEASURING TESTING
Information Patent Grant
Uniform solder reflow fixture
- Patent number 8,444,043
- Issue date May 21, 2013
- International Business Machines Corporation
- William E. Bernier
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Compressible films surrounding solder connectors
- Patent number 7,566,649
- Issue date Jul 28, 2009
- International Business Machines Corporation
- William E. Bernier
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low stress conductive polymer bump
- Patent number 7,442,878
- Issue date Oct 28, 2008
- International Business Machines Corporation
- William E. Bernier
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Compressible films surrounding solder connectors
- Patent number 7,332,821
- Issue date Feb 19, 2008
- International Business Machines Corporation
- William E. Bernier
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Compliant electrical contacts
- Patent number 7,316,572
- Issue date Jan 8, 2008
- International Business Machines Corporation
- William E. Bernier
- G01 - MEASURING TESTING
Information Patent Grant
Low stress conductive polymer bump
- Patent number 7,170,187
- Issue date Jan 30, 2007
- International Business Machines Corporation
- William E. Bernier
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Extension of fatigue life for C4 solder ball to chip connection
- Patent number 7,119,003
- Issue date Oct 10, 2006
- International Business Machines Corporation
- William E. Bernier
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Extension of fatigue life for C4 solder ball to chip connection
- Patent number 7,067,916
- Issue date Jun 27, 2006
- International Business Machines Corporation
- William E. Bernier
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder protective coating and fluxless joining of flip chip devices...
- Patent number 6,921,015
- Issue date Jul 26, 2005
- International Business Machines Corporation
- William E. Bernier
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder protective coating and fluxless joining of flip chip devices...
- Patent number 6,585,150
- Issue date Jul 1, 2003
- International Business Machines Corporation
- William E. Bernier
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and device for semiconductor testing using electrically cond...
- Patent number 6,559,666
- Issue date May 6, 2003
- International Business Machines Corporation
- William E. Bernier
- G01 - MEASURING TESTING
Information Patent Grant
Flux composition and soldering method for high density arrays
- Patent number 6,550,667
- Issue date Apr 22, 2003
- International Business Machines Corporation
- William E. Bernier
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer scale encapsulation for integrated flip chip and surface moun...
- Patent number 6,492,071
- Issue date Dec 10, 2002
- International Business Machines Corporation
- William E. Bernier
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive adhesive having a palladium matrix interface between two...
- Patent number 6,425,772
- Issue date Jul 30, 2002
- International Business Machines Corporation
- William E. Bernier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive adhesive having a palladium matrix interface between two...
- Patent number 6,331,119
- Issue date Dec 18, 2001
- International Business Machines Corporation
- William E. Bernier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor testing using electrically conductive adhesives
- Patent number 6,288,559
- Issue date Sep 11, 2001
- International Business Machines Corporation
- William E. Bernier
- G01 - MEASURING TESTING
Information Patent Grant
Method and device for semiconductor testing using electrically cond...
- Patent number 6,268,739
- Issue date Jul 31, 2001
- International Business Machines Corporation
- William E. Bernier
- G01 - MEASURING TESTING
Information Patent Grant
Selective wafer-level testing and burn-in
- Patent number 6,255,208
- Issue date Jul 3, 2001
- International Business Machines Corporation
- William Emmett Bernier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Attaching heat sinks directly to flip chips and ceramic chip carriers
- Patent number 6,251,707
- Issue date Jun 26, 2001
- International Business Machines Corporation
- William Emmett Bernier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Attaching heat sinks directly to flip chips and ceramic chip carriers
- Patent number 6,069,023
- Issue date May 30, 2000
- International Business Machines Corporation
- William Emmett Bernier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Attaching heat sinks directly to flip chips and ceramic chip carriers
- Patent number 5,847,929
- Issue date Dec 8, 1998
- International Business Machines Corporation
- William Emmett Bernier
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
RESILIENT DIRECT PART MARKING ON CARBON STEEL USING LASER ENGRAVING...
- Publication number 20230105420
- Publication date Apr 6, 2023
- OPERATIONS TECHNOLOGY DEVELOPMENT, NFP
- William Gale
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Silicon Interposer Sandwich Structure for ESD, EMC, and EMC Shieldi...
- Publication number 20210288022
- Publication date Sep 16, 2021
- International Business Machines Corporation
- William EMMETT BERNIER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL OXIDE NANOFIBROUS MATERIALS FOR PHOTODEGRADATION OF ENVIRONME...
- Publication number 20200316577
- Publication date Oct 8, 2020
- The Research Foundation for The State University of New York
- Wayne E. Jones
- D01 - NATURAL OR ARTIFICIAL THREADS OR FIBRES SPINNING
Information Patent Application
Silicon Interposer Sndwich Structure for ESD, EMI, and EMC Shieldin...
- Publication number 20180350768
- Publication date Dec 6, 2018
- International Business Machines Corporation
- WILLIAM E. BERNIER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLAT LAMINATE, SYMMETRICAL TEST STRUCTURES AND METHOD OF USE TO GAU...
- Publication number 20180082912
- Publication date Mar 22, 2018
- International Business Machines Corporation
- William E. Bernier
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
METAL OXIDE NANOFIBROUS MATERIALS FOR PHOTODEGRADATION OF ENVIRONME...
- Publication number 20170056873
- Publication date Mar 2, 2017
- The Research Foundation for The State University of New York
- Wayne E. Jones
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
Silicon Interposer Sndwich Structure for ESD, EMI, and EMC Shieldin...
- Publication number 20160233190
- Publication date Aug 11, 2016
- International Business Machines Corporation
- WILLIAM E. BERNIER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLAT LAMINATE, SYMMETRICAL TEST STRUCTURES AND METHOD OF USE TO GAU...
- Publication number 20150036716
- Publication date Feb 5, 2015
- International Business Machines Corporation
- William E. Bernier
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
CONDUCTIVE FILMS AND DEVICES COMPRISED THEREOF
- Publication number 20140272342
- Publication date Sep 18, 2014
- THE RESEARCH FOUNDATION OF STATE UNIVERSITY OF NEW YORK
- William E. Bernier
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Flat Laminate, Symmetrical Test Structures and Method of Use To Gau...
- Publication number 20130098176
- Publication date Apr 25, 2013
- International Business Machines Corporation
- William E. Bernier
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
Interposer for ESD, EMI, and EMC
- Publication number 20130082365
- Publication date Apr 4, 2013
- International Business Machines Corporation
- WILLIAM E. BERNIER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPRESSIBLE FILMS SURROUNDING SOLDER CONNECTORS
- Publication number 20080009101
- Publication date Jan 10, 2008
- William E. Bernier
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
COMPLIANT ELECTRICAL CONTACTS
- Publication number 20080000080
- Publication date Jan 3, 2008
- William E. Bernier
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
LOW STRESS CONDUCTIVE POLYMER BUMP
- Publication number 20070084629
- Publication date Apr 19, 2007
- William E. Bernier
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPLIANT ELECTRICAL CONTACTS
- Publication number 20060172565
- Publication date Aug 3, 2006
- International Business Machines Corporation
- William E. Bernier
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
LOW STRESS CONDUCTIVE POLYMER BUMP
- Publication number 20060043608
- Publication date Mar 2, 2006
- International Business Machines Corporation
- William E. Bernier
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPRESSIBLE FILMS SURROUNDING SOLDER CONNECTORS
- Publication number 20060040567
- Publication date Feb 23, 2006
- International Business Machines Corporation
- William E. Bernier
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Extension of fatigue life for C4 solder ball to chip connection
- Publication number 20050224973
- Publication date Oct 13, 2005
- William E. Bernier
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Solder protective coating and fluxless joining of flip chip devices...
- Publication number 20030178473
- Publication date Sep 25, 2003
- International Business Machines Corporation
- William E. Bernier
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Extension of fatigue life for C4 solder ball to chip connection
- Publication number 20020195707
- Publication date Dec 26, 2002
- International Business Machines Corporation
- William E. Bernier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flux composition and soldering method for high density arrays
- Publication number 20020063146
- Publication date May 30, 2002
- William E. Bernier
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Conductive adhesive having a palladium matrix interface between two...
- Publication number 20020022384
- Publication date Feb 21, 2002
- International Business Machines Corporation
- William E. Bernier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and device for semiconductor testing using electrically cond...
- Publication number 20010035759
- Publication date Nov 1, 2001
- William E. Bernier
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR TESTING USING ELECTRICALLY CONDUCTIVE ADHESIVES
- Publication number 20010024127
- Publication date Sep 27, 2001
- WILLIAM E. BERNIER
- G01 - MEASURING TESTING

William E. Bernier

Person

Patents Grantslast 30 patents

Silicon interposer sandwich structure for ESD, EMC, and EMC shieldi...

Silicon interposer sandwich structure for ESD, EMC, and EMC shieldi...

Flat laminate, symmetrical test structures and method of use to gau...

Metal oxide nanofibrous materials for photodegradation of environme...

Increased thermal stabilization of optical absorbers

Conductive films and devices comprised thereof

Increased thermal stabilization of optical absorbers

Flat laminate, symmetrical test structures and method of use to gau...

Flat laminate, symmetrical test structures and method of use to gau...

Uniform solder reflow fixture

Compressible films surrounding solder connectors

Low stress conductive polymer bump

Compressible films surrounding solder connectors

Compliant electrical contacts

Low stress conductive polymer bump

Extension of fatigue life for C4 solder ball to chip connection

Extension of fatigue life for C4 solder ball to chip connection

Solder protective coating and fluxless joining of flip chip devices...

Solder protective coating and fluxless joining of flip chip devices...

Method and device for semiconductor testing using electrically cond...

Flux composition and soldering method for high density arrays

Wafer scale encapsulation for integrated flip chip and surface moun...

Conductive adhesive having a palladium matrix interface between two...

Conductive adhesive having a palladium matrix interface between two...

Semiconductor testing using electrically conductive adhesives

Method and device for semiconductor testing using electrically cond...

Selective wafer-level testing and burn-in

Attaching heat sinks directly to flip chips and ceramic chip carriers

Attaching heat sinks directly to flip chips and ceramic chip carriers

Attaching heat sinks directly to flip chips and ceramic chip carriers

Patents Applicationslast 30 patents

RESILIENT DIRECT PART MARKING ON CARBON STEEL USING LASER ENGRAVING...

Silicon Interposer Sandwich Structure for ESD, EMC, and EMC Shieldi...

METAL OXIDE NANOFIBROUS MATERIALS FOR PHOTODEGRADATION OF ENVIRONME...

Silicon Interposer Sndwich Structure for ESD, EMI, and EMC Shieldin...

FLAT LAMINATE, SYMMETRICAL TEST STRUCTURES AND METHOD OF USE TO GAU...

METAL OXIDE NANOFIBROUS MATERIALS FOR PHOTODEGRADATION OF ENVIRONME...

Silicon Interposer Sndwich Structure for ESD, EMI, and EMC Shieldin...

FLAT LAMINATE, SYMMETRICAL TEST STRUCTURES AND METHOD OF USE TO GAU...

CONDUCTIVE FILMS AND DEVICES COMPRISED THEREOF

Flat Laminate, Symmetrical Test Structures and Method of Use To Gau...

Interposer for ESD, EMI, and EMC

COMPRESSIBLE FILMS SURROUNDING SOLDER CONNECTORS

COMPLIANT ELECTRICAL CONTACTS

LOW STRESS CONDUCTIVE POLYMER BUMP

COMPLIANT ELECTRICAL CONTACTS

LOW STRESS CONDUCTIVE POLYMER BUMP

COMPRESSIBLE FILMS SURROUNDING SOLDER CONNECTORS

Extension of fatigue life for C4 solder ball to chip connection

Solder protective coating and fluxless joining of flip chip devices...

Extension of fatigue life for C4 solder ball to chip connection

Flux composition and soldering method for high density arrays

Conductive adhesive having a palladium matrix interface between two...

Method and device for semiconductor testing using electrically cond...

SEMICONDUCTOR TESTING USING ELECTRICALLY CONDUCTIVE ADHESIVES