William E. Boyd

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San Clemente, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Stacked ball grid array package module utilizing one or more interp...
- Patent number 8,299,594
- Issue date Oct 30, 2012
- Aprolase Development Co., LLC
- Daniel Michaels
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stacked ball grid array package module utilizing one or more interp...
- Patent number 7,709,943
- Issue date May 4, 2010
- Daniel Michaels
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
BGA-scale stacks comprised of layers containing integrated circuit...
- Patent number 7,511,369
- Issue date Mar 31, 2009
- Irvine Sensors Corp.
- Gann Keith
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
STACKED BALL GRID ARRAY PACKAGE MODULE UTILIZING ONE OR MORE INTERP...
- Publication number 20100140777
- Publication date Jun 10, 2010
- Daniel Michaels
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BGA-scale stacks comprised of layers containing integrated circuit...
- Publication number 20070158805
- Publication date Jul 12, 2007
- Gann Keith
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked ball grid array package module utilizing one or more interp...
- Publication number 20060180912
- Publication date Aug 17, 2006
- Daniel Michaels
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR