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William E. Kehret
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Oakland, CA, US
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Patents Grants
last 30 patents
Information
Patent Grant
Printed circuit board module enclosure and apparatus using same
Patent number
8,427,828
Issue date
Apr 23, 2013
Themis Computer
William E. Kehret
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Ruggedized electronics enclosure
Patent number
6,944,022
Issue date
Sep 13, 2005
Themis Computer
William E. Kehret
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Ruggedized electronics enclosure
Patent number
6,765,793
Issue date
Jul 20, 2004
Themis Corporation
William E. Kehret
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
PRINTED CIRCUIT BOARD MODULE ENCLOSURE AND APPARATUS USING SAME
Publication number
20120020017
Publication date
Jan 26, 2012
William E. Kehret
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
Thermal Management for a Ruggedized Electronics Enclosure
Publication number
20080218970
Publication date
Sep 11, 2008
Themis Computer
William E. Kehret
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
CLAMSHELL ENCLOSURE FOR ELECTRONIC CIRCUIT ASSEMBLIES
Publication number
20080174960
Publication date
Jul 24, 2008
Themis Computer
William E. Kehret
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Ruggedized electronics enclosure
Publication number
20070177348
Publication date
Aug 2, 2007
William E. Kehret
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Thermal management for a ruggedized electronics enclosure
Publication number
20070041160
Publication date
Feb 22, 2007
William E. Kehret
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Ruggedized electronics enclosure
Publication number
20040042175
Publication date
Mar 4, 2004
William E. Kehret
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR