William F. Shutler

Person

Wappingers Falls, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Jogging structure for wiring translation between grids with non-int...
- Patent number 6,974,722
- Issue date Dec 13, 2005
- International Business Machines Corporation
- Glenn G. Daves
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Jogging structure for wiring translation between grids with non-int...
- Patent number 6,762,489
- Issue date Jul 13, 2004
- International Business Machines Corporation
- Glenn G. Daves
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High bandwidth 3D memory packaging technique
- Patent number 6,469,375
- Issue date Oct 22, 2002
- William F. Beausoleil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with low stress hermetic seal
- Patent number 6,459,160
- Issue date Oct 1, 2002
- International Business Machines Corporation
- Lewis Sigmund Goldmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
MCM—MLC technology
- Patent number 6,442,041
- Issue date Aug 27, 2002
- International Business Machines Corporation
- Simone Rehm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low stress hermetic seal
- Patent number 6,342,407
- Issue date Jan 29, 2002
- International Business Machines Corporation
- Lewis Sigmund Goldmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Two-stage power noise filter with on and off chip capacitors
- Patent number 6,043,724
- Issue date Mar 28, 2000
- International Business Machines Corporation
- Roland Frech
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Multilayer module with thinfilm redistribution area
- Patent number 5,914,533
- Issue date Jun 22, 1999
- International Business Machines Corporation
- Roland Frech
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated thermoelectric cooling
- Patent number 5,032,897
- Issue date Jul 16, 1991
- International Business Machines Corp.
- Mohanlal S. Mansuria
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
JOGGING STRUCTURE FOR WIRING TRANSLATION BETWEEN GRIDS WITH NON-INT...
- Publication number 20040188823
- Publication date Sep 30, 2004
- International Business Machines Corporation
- Glenn G. Daves
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Structure and method for wiring translation between grids with non-...
- Publication number 20030094687
- Publication date May 22, 2003
- Glenn G. Daves
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH BANDWIDTH 3D MEMORY PACKAGING TECHNIQUE
- Publication number 20020117741
- Publication date Aug 29, 2002
- William F. Beausoleil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package with low stress hermetic seal
- Publication number 20020090761
- Publication date Jul 11, 2002
- Lewis Sigmund Goldmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Novel MCM -MLC technology
- Publication number 20010046125
- Publication date Nov 29, 2001
- International Business Machines Corporation
- Simone Rehm
- H01 - BASIC ELECTRIC ELEMENTS

William F. Shutler

Person

Patents Grantslast 30 patents

Jogging structure for wiring translation between grids with non-int...

Jogging structure for wiring translation between grids with non-int...

High bandwidth 3D memory packaging technique

Package with low stress hermetic seal

MCM&#x02014;MLC technology

Low stress hermetic seal

Two-stage power noise filter with on and off chip capacitors

Multilayer module with thinfilm redistribution area

Integrated thermoelectric cooling

Patents Applicationslast 30 patents

JOGGING STRUCTURE FOR WIRING TRANSLATION BETWEEN GRIDS WITH NON-INT...

Structure and method for wiring translation between grids with non-...

HIGH BANDWIDTH 3D MEMORY PACKAGING TECHNIQUE

Package with low stress hermetic seal

Novel MCM -MLC technology

MCM—MLC technology