William G. Easter

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Wernersville, PA, US

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Patents Grantslast 30 patents

Information Patent Grant
Getterer for multi-layer wafers and method for making same
- Patent number 5,892,292
- Issue date Apr 6, 1999
- Lucent Technologies Inc.
- William Graham Easter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a getterer for multi-layer wafers
- Patent number 5,478,758
- Issue date Dec 26, 1995
- AT&T Corp.
- William G. Easter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing an integrated circuit including planarizing...
- Patent number 5,366,924
- Issue date Nov 22, 1994
- AT&T Bell Laboratories
- William G. Easter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer bonded dielectrically isolated structures
- Patent number H1174
- Issue date Apr 6, 1993
- American Telephone and Telegraph Company
- William G. Easter
- 357 -
Information Patent Grant
Wafer bonding technique for dielectric isolation processing
- Patent number H1137
- Issue date Feb 2, 1993
- American Telephone and Telegraph Company
- William G. Easter
- 437 -