William G. McDonald

Person

Scottsdale, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Capacitive pressure sensor in an overmolded package
- Patent number 9,146,170
- Issue date Sep 29, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Jian Wen
- G01 - MEASURING TESTING
Information Patent Grant
Method of making a dual port pressure sensor
- Patent number 9,021,689
- Issue date May 5, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Stephen R. Hooper
- G01 - MEASURING TESTING
Information Patent Grant
Lead frame having a flag with in-plane and out-of-plane mold lockin...
- Patent number 8,742,555
- Issue date Jun 3, 2014
- Jian Wen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for high pressure sensor device
- Patent number 8,686,550
- Issue date Apr 1, 2014
- FREESCALE SEMICONDUCTOR, INC.
- William G. McDonald
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Methods for fabricating sensor device package using a sealing struc...
- Patent number 8,476,087
- Issue date Jul 2, 2013
- FREESCALE SEMICONDUCTOR, INC.
- Stephen R. Hooper
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sensor device with sealing structure
- Patent number 8,384,168
- Issue date Feb 26, 2013
- FREESCALE SEMICONDUCTOR, INC.
- Stephen R. Hooper
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Molded differential PRT pressure sensor
- Patent number 8,359,927
- Issue date Jan 29, 2013
- FREESCALE SEMICONDUCTOR, INC.
- Stephen R. Hooper
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Dual port pressure sensor
- Patent number 8,307,714
- Issue date Nov 13, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Stephen R. Hooper
- G01 - MEASURING TESTING
Information Patent Grant
Exposed pad backside pressure sensor package
- Patent number 7,900,521
- Issue date Mar 8, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Stephen R. Hooper
- G01 - MEASURING TESTING
Information Patent Grant
Methods for forming quad flat no-lead (QFN) packages
- Patent number 7,713,781
- Issue date May 11, 2010
- FREESCALE SEMICONDUCTOR, INC.
- James J. Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Quad flat no-lead (QFN) packages
- Patent number 7,652,357
- Issue date Jan 26, 2010
- FREESCALE SEMICONDUCTOR, INC.
- James J. Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for a Quad Flat No-Lead (QFN) package
- Patent number 7,489,026
- Issue date Feb 10, 2009
- FREESCALE SEMICONDUCTOR, INC.
- James J. Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of using a differential pressure type flowmeter
- Patent number 7,437,951
- Issue date Oct 21, 2008
- FREESCALE SEMICONDUCTOR, INC.
- William G. McDonald
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Substrate contact for a capped MEMS and method of making the substr...
- Patent number 7,316,965
- Issue date Jan 8, 2008
- FREESCALE SEMICONDUCTOR, INC.
- Stephen R. Hooper
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Flowmeter and method for the making thereof
- Patent number 7,261,003
- Issue date Aug 28, 2007
- FREESCALE SEMICONDUCTOR, INC.
- William G. McDonald
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Methods and apparatus having wafer level chip scale package for sen...
- Patent number 7,109,055
- Issue date Sep 19, 2006
- FREESCALE SEMICONDUCTOR, INC.
- William G. McDonald
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method and structure for fabricating sensors with a sacrificial gel...
- Patent number 7,014,888
- Issue date Mar 21, 2006
- FREESCALE SEMICONDUCTOR, INC.
- William G. McDonald
- G01 - MEASURING TESTING
Information Patent Grant
Component having a filter
- Patent number 6,769,319
- Issue date Aug 3, 2004
- FREESCALE SEMICONDUCTOR, INC.
- William G. McDonald
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor component and method of manufacturing same
- Patent number 6,683,370
- Issue date Jan 27, 2004
- Motorola, Inc.
- William G. McDonald
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro electro-mechanical system sensor with selective encapsulation...
- Patent number 6,401,545
- Issue date Jun 11, 2002
- Motorola, Inc.
- David J. Monk
- G01 - MEASURING TESTING
Information Patent Grant
Saddle bracket for solid state pressure gauge
- Patent number 6,177,727
- Issue date Jan 23, 2001
- Motorola, Inc.
- John W. Hart
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
CAPACITIVE PRESSURE SENSOR IN AN OVERMOLDED PACKAGE
- Publication number 20140033814
- Publication date Feb 6, 2014
- Jian Wen
- G01 - MEASURING TESTING
Information Patent Application
METHOD AND APPARATUS FOR HIGH PRESSURE SENSOR DEVICE
- Publication number 20130207207
- Publication date Aug 15, 2013
- William G. McDonald
- B60 - VEHICLES IN GENERAL
Information Patent Application
LEAD FRAME HAVING A FLAG WITH IN-PLANE AND OUT-OF-PLANE MOLD LOCKIN...
- Publication number 20130049181
- Publication date Feb 28, 2013
- Jian Wen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING A DUAL PORT PRESSURE SENSOR
- Publication number 20120304452
- Publication date Dec 6, 2012
- STEPHEN R. HOOPER
- G01 - MEASURING TESTING
Information Patent Application
DUAL PORT PRESSURE SENSOR
- Publication number 20120304777
- Publication date Dec 6, 2012
- STEPHEN R. HOOPER
- G01 - MEASURING TESTING
Information Patent Application
METHODS FOR FABRICATING SENSOR DEVICE PACKAGE USING A SEALING STRUC...
- Publication number 20120270354
- Publication date Oct 25, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Stephen R. Hooper
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SENSOR DEVICE WITH SEALING STRUCTURE
- Publication number 20120266684
- Publication date Oct 25, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Stephen R. Hooper
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Molded Differential PRT Pressure Sensor
- Publication number 20110036174
- Publication date Feb 17, 2011
- Stephen R. Hooper
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Exposed Pad Backside Pressure Sensor Package
- Publication number 20100199777
- Publication date Aug 12, 2010
- Stephen R. Hooper
- G01 - MEASURING TESTING
Information Patent Application
QUAD FLAT NO-LEAD (QFN) PACKAGES
- Publication number 20090152710
- Publication date Jun 18, 2009
- FREESCALE SEMICONDUCTOR, INC.
- James J. Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FORMING QUAD FLAT NO-LEAD (QFN) PACKAGES
- Publication number 20090004775
- Publication date Jan 1, 2009
- FREESCALE SEMICONDUCTOR, INC.
- James J. Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods and apparatus for a Quad Flat No-Lead (QFN) package
- Publication number 20080099899
- Publication date May 1, 2008
- James J. Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLOWMETER AND METHOD FOR THE MAKING THEREOF
- Publication number 20070277623
- Publication date Dec 6, 2007
- FREESCALE SEMICONDUCTOR, INC.
- William G. McDonald
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
FLOWMETER AND METHOD FOR THE MAKING THEREOF
- Publication number 20070151366
- Publication date Jul 5, 2007
- William G. McDonald
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
Substrate contact for a capped MEMS and method of making the substr...
- Publication number 20060286707
- Publication date Dec 21, 2006
- Stephen R. Hooper
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method of making a substrate contact for a capped MEMS at the packa...
- Publication number 20060286706
- Publication date Dec 21, 2006
- Arvind S. Salian
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHODS AND APPARATUS HAVING WAFER LEVEL CHIP SCALE PACKAGE FOR SEN...
- Publication number 20060160264
- Publication date Jul 20, 2006
- William G. McDonald
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method and structure for fabricating sensors with a sacrificial gel...
- Publication number 20040118214
- Publication date Jun 24, 2004
- MOTOROLA, INC.
- William G. McDonald
- G01 - MEASURING TESTING
Information Patent Application
Component having a filter and method of manufacturing
- Publication number 20030005782
- Publication date Jan 9, 2003
- MOTOROLA, INC.
- William G. McDonald
- G01 - MEASURING TESTING

William G. McDonald

Person

Patents Grantslast 30 patents

Capacitive pressure sensor in an overmolded package

Method of making a dual port pressure sensor

Lead frame having a flag with in-plane and out-of-plane mold lockin...

Method and apparatus for high pressure sensor device

Methods for fabricating sensor device package using a sealing struc...

Sensor device with sealing structure

Molded differential PRT pressure sensor

Dual port pressure sensor

Exposed pad backside pressure sensor package

Methods for forming quad flat no-lead (QFN) packages

Quad flat no-lead (QFN) packages

Methods and apparatus for a Quad Flat No-Lead (QFN) package

Method of using a differential pressure type flowmeter

Substrate contact for a capped MEMS and method of making the substr...

Flowmeter and method for the making thereof

Methods and apparatus having wafer level chip scale package for sen...

Method and structure for fabricating sensors with a sacrificial gel...

Component having a filter

Semiconductor component and method of manufacturing same

Micro electro-mechanical system sensor with selective encapsulation...

Saddle bracket for solid state pressure gauge

Patents Applicationslast 30 patents

CAPACITIVE PRESSURE SENSOR IN AN OVERMOLDED PACKAGE

METHOD AND APPARATUS FOR HIGH PRESSURE SENSOR DEVICE

LEAD FRAME HAVING A FLAG WITH IN-PLANE AND OUT-OF-PLANE MOLD LOCKIN...

METHOD OF MAKING A DUAL PORT PRESSURE SENSOR

DUAL PORT PRESSURE SENSOR

METHODS FOR FABRICATING SENSOR DEVICE PACKAGE USING A SEALING STRUC...

SENSOR DEVICE WITH SEALING STRUCTURE

Molded Differential PRT Pressure Sensor

Exposed Pad Backside Pressure Sensor Package

QUAD FLAT NO-LEAD (QFN) PACKAGES

METHODS FOR FORMING QUAD FLAT NO-LEAD (QFN) PACKAGES

Methods and apparatus for a Quad Flat No-Lead (QFN) package

FLOWMETER AND METHOD FOR THE MAKING THEREOF

FLOWMETER AND METHOD FOR THE MAKING THEREOF

Substrate contact for a capped MEMS and method of making the substr...

Method of making a substrate contact for a capped MEMS at the packa...

METHODS AND APPARATUS HAVING WAFER LEVEL CHIP SCALE PACKAGE FOR SEN...

Method and structure for fabricating sensors with a sacrificial gel...

Component having a filter and method of manufacturing