William H. Holtkamp

Person

Santa Clara, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method for depositing and/or removing material on a substrate
- Patent number 6,365,025
- Issue date Apr 2, 2002
- Cutek Research, Inc.
- Chiu H. Ting
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Multiple station processing chamber and method for depositing and/o...
- Patent number 6,187,152
- Issue date Feb 13, 2001
- Cutek Research, Inc.
- Chiu H. Ting
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method and apparatus for the disposal of processing fluid used to d...
- Patent number 6,183,611
- Issue date Feb 6, 2001
- Cutek Research, Inc.
- Chiu H. Ting
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Introducing and reclaiming liquid in a wafer processing chamber
- Patent number 6,179,982
- Issue date Jan 30, 2001
- Cutek Research, Inc.
- Chiu H. Ting
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Rotating anode for a wafer processing chamber
- Patent number 6,077,412
- Issue date Jun 20, 2000
- Cutek Research, Inc.
- Chiu H. Ting
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Apparatus and method utilizing an electrode adapter for customized...
- Patent number 6,022,465
- Issue date Feb 8, 2000
- Cutek Research, Inc.
- Chiu H. Ting
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Integrated vacuum and plating cluster system
- Patent number 6,017,820
- Issue date Jan 25, 2000
- Cutek Research, Inc.
- Chiu H. Ting
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Process chamber and method for depositing and/or removing material...
- Patent number 6,017,437
- Issue date Jan 25, 2000
- Cutek Research, Inc.
- Chiu H. Ting
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Methods for sealing and unsealing using a magnetically permeable so...
- Patent number 5,704,613
- Issue date Jan 6, 1998
- William H. Holtkamp
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Devices employing a liquid-free medium
- Patent number 5,660,397
- Issue date Aug 26, 1997
- William H. Holtkamp
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

William H. Holtkamp

Person

Patents Grantslast 30 patents

Method for depositing and/or removing material on a substrate

Multiple station processing chamber and method for depositing and/o...

Method and apparatus for the disposal of processing fluid used to d...

Introducing and reclaiming liquid in a wafer processing chamber

Rotating anode for a wafer processing chamber

Apparatus and method utilizing an electrode adapter for customized...

Integrated vacuum and plating cluster system

Process chamber and method for depositing and/or removing material...

Methods for sealing and unsealing using a magnetically permeable so...

Devices employing a liquid-free medium