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William H. Howland, Jr.
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Wexford, PA, US
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last 30 patents
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Patent Grant
In-situ wafer and probe desorption using closed loop heating
Patent number
7,304,490
Issue date
Dec 4, 2007
Solid State Measurements, Inc.
William H. Howland, Jr.
G01 - MEASURING TESTING
Information
Patent Grant
Method of measuring semiconductor wafers with an oxide enhanced probe
Patent number
7,282,941
Issue date
Oct 16, 2007
Solid State Measurements, Inc.
William H. Howland, Jr.
G01 - MEASURING TESTING
Information
Patent Grant
Method and apparatus for determining concentration of defects and/o...
Patent number
7,190,186
Issue date
Mar 13, 2007
Solid State Measurements, Inc.
William H. Howland, Jr.
G01 - MEASURING TESTING
Information
Patent Grant
Method and apparatus for determining the dielectric constant of a l...
Patent number
7,026,837
Issue date
Apr 11, 2006
Solid State Measurements, Inc.
William H. Howland, Jr.
G01 - MEASURING TESTING
Information
Patent Grant
Work function controlled probe for measuring properties of a semico...
Patent number
7,023,231
Issue date
Apr 4, 2006
Solid State Measurements, Inc.
William H. Howland, Jr.
G01 - MEASURING TESTING
Information
Patent Grant
Method and apparatus for removing and/or preventing surface contami...
Patent number
7,007,408
Issue date
Mar 7, 2006
Solid State Measurements, Inc.
William H. Howland, Jr.
B08 - CLEANING
Information
Patent Grant
Apparatus and method for detecting soft breakdown of a dielectric l...
Patent number
7,005,307
Issue date
Feb 28, 2006
Solid State Measurements, Inc.
William H. Howland, Jr.
G01 - MEASURING TESTING