William H. Lytle

Person

Tempe, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method for singulating electronic components from a substrate
- Patent number 9,142,434
- Issue date Sep 22, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Wei Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Warp compensated electronic assemblies
- Patent number 9,107,303
- Issue date Aug 11, 2015
- FREESCALE SEMICONDUCTOR, INC.
- William H. Lytle
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Warp compensated package and method
- Patent number 8,829,661
- Issue date Sep 9, 2014
- FREESCALE SEMICONDUCTOR, INC.
- William H. Lytle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a semiconductor package including two devices
- Patent number 8,415,203
- Issue date Apr 9, 2013
- FREESCALE SEMICONDUCTOR, INC.
- Kenneth R. Burch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for releasing a microelectronic assembly from a carrier subs...
- Patent number 8,327,532
- Issue date Dec 11, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Jianwen Xu
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Flexible carrier for high volume electronic package fabrication
- Patent number 7,969,026
- Issue date Jun 28, 2011
- FREESCALE SEMICONDUCTOR, INC.
- William H. Lytle
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method for forming a packaged semiconductor device
- Patent number 7,838,420
- Issue date Nov 23, 2010
- FREESCALE SEMICONDUCTOR, INC.
- Jinbang Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a package with exposed component surfaces
- Patent number 7,820,485
- Issue date Oct 26, 2010
- FREESCALE SEMICONDUCTOR, INC.
- William H. Lytle
- G01 - MEASURING TESTING
Information Patent Grant
Electronic assembly manufacturing method
- Patent number 7,802,359
- Issue date Sep 28, 2010
- FREESCALE SEMICONDUCTOR, INC.
- William H. Lytle
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Integrated circuit package formation
- Patent number 7,741,151
- Issue date Jun 22, 2010
- FREESCALE SEMICONDUCTOR, INC.
- Craig S. Amrine
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of packaging an integrated circuit die
- Patent number 7,595,226
- Issue date Sep 29, 2009
- FREESCALE SEMICONDUCTOR, INC.
- William H. Lytle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible carrier and release method for high volume electronic pack...
- Patent number 7,442,581
- Issue date Oct 28, 2008
- FREESCALE SEMICONDUCTOR, INC.
- William H. Lytle
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Corrosion-resistant copper bond pad and integrated device
- Patent number 7,078,796
- Issue date Jul 18, 2006
- FREESCALE SEMICONDUCTOR, INC.
- Gregory J. Dunn
- G01 - MEASURING TESTING
Information Patent Grant
Activation plate for electroless and immersion plating of integrate...
- Patent number 6,974,776
- Issue date Dec 13, 2005
- FREESCALE SEMICONDUCTOR, INC.
- Timothy B. Dean
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Wafer level MEMS packaging
- Patent number 6,953,985
- Issue date Oct 11, 2005
- FREESCALE SEMICONDUCTOR, INC.
- Jong-Kai Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Low cost fabrication and assembly of lid for semiconductor devices
- Patent number 6,949,398
- Issue date Sep 27, 2005
- Freescale Semiconductor, Inc.
- William H. Lytle
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Apparatus and method for cold cross-sectioning of soft materials
- Patent number 6,302,775
- Issue date Oct 16, 2001
- Motorola, Inc.
- Russell Thomas Lee
- B24 - GRINDING POLISHING
Information Patent Grant
Bonding structure for an electronic device
- Patent number 5,912,510
- Issue date Jun 15, 1999
- Motorola, Inc.
- Lih-Tyng Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming an electrically conductive polymer bump over an a...
- Patent number 5,674,780
- Issue date Oct 7, 1997
- Motorola, Inc.
- William H. Lytle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming contact pads for wafer level testing and burn-in...
- Patent number 5,593,903
- Issue date Jan 14, 1997
- Motorola, Inc.
- William M. Beckenbaugh
- G01 - MEASURING TESTING
Information Patent Grant
Method of forming an electrical interconnect
- Patent number 5,587,342
- Issue date Dec 24, 1996
- Motorola, Inc.
- Jong-Kai Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect system for a semiconductor chip and a substrate
- Patent number 5,411,400
- Issue date May 2, 1995
- Motorola, Inc.
- Ravichandran Subrahmanyan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of etching copper layers
- Patent number 5,409,567
- Issue date Apr 25, 1995
- Motorola, Inc.
- William H. Lytle
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Adjustable plating cell for uniform bump plating of semiconductor w...
- Patent number 5,391,285
- Issue date Feb 21, 1995
- Motorola, Inc.
- William H. Lytle
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Device for solder removal
- Patent number 5,072,873
- Issue date Dec 17, 1991
- Motorola, Inc.
- Jay J. Liu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electroless plating of portions of semiconductor devices and the like
- Patent number 5,028,454
- Issue date Jul 2, 1991
- Motorola Inc.
- William H. Lytle
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Backside metallization scheme for semiconductor devices
- Patent number 4,946,376
- Issue date Aug 7, 1990
- Motorola, Inc.
- Ravinder K. Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of chemically etching TiW and/or TiWN
- Patent number 4,787,958
- Issue date Nov 29, 1988
- Motorola Inc.
- William H. Lytle
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
WARP COMPENSATED ELECTRONIC ASSEMBLIES
- Publication number 20140369015
- Publication date Dec 18, 2014
- William H. Lytle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR SINGULATING ELECTRONIC COMPONENTS FROM A SUBSTRATE
- Publication number 20110217814
- Publication date Sep 8, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Wei Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEM FOR RELEASING A MICROELECTRONIC ASSEMBLY FROM A C...
- Publication number 20110119910
- Publication date May 26, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Jianwen Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE FORMATION
- Publication number 20100112756
- Publication date May 6, 2010
- Craig S. Amrine
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A PACKAGE WITH EXPOSED COMPONENT SURFACES
- Publication number 20100081234
- Publication date Apr 1, 2010
- WILLIAM H. LYTLE
- G01 - MEASURING TESTING
Information Patent Application
ELECTRONIC ASSEMBLY MANUFACTURING METHOD
- Publication number 20090165293
- Publication date Jul 2, 2009
- FREESCALE SEMICONDUCTOR, INC.
- William H. Lytle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PACKAGING AN INTEGRATED CIRCUIT DIE
- Publication number 20090061564
- Publication date Mar 5, 2009
- FREESCALE SEMICONDUCTOR, INC.
- William H. Lytle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT IN A MULTI-ELEMENT PACKAGE
- Publication number 20090057849
- Publication date Mar 5, 2009
- Jinbang Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE CARRIER FOR HIGH VOLUME ELECTRONIC PACKAGE FABRICATION
- Publication number 20090008802
- Publication date Jan 8, 2009
- FREESCALE SEMICONDUCTOR, INC.
- William H. Lytle
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
METHOD FOR FORMING A MICROELECTRONIC ASSEMBLY INCLUDING ENCAPSULATI...
- Publication number 20080182363
- Publication date Jul 31, 2008
- FREESCALE SEMICONDUCTOR, INC.
- Craig S. Amrine
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Warp compensated package and method
- Publication number 20070210427
- Publication date Sep 13, 2007
- William H. Lytle
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Flexible carrier and release method for high volume electronic pack...
- Publication number 20060128066
- Publication date Jun 15, 2006
- William H. Lytle
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Corrosion-resistant bond pad and integrated device
- Publication number 20050104207
- Publication date May 19, 2005
- Timothy B. Dean
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Activation plate for electroless and immersion plating of integrate...
- Publication number 20050003677
- Publication date Jan 6, 2005
- MOTOROLA, INC.
- Timothy B. Dean
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Corrosion-resistant bond pad and integrated device
- Publication number 20050001316
- Publication date Jan 6, 2005
- MOTOROLA, INC.
- Timothy B. Dean
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Corrosion-resistant copper bond pad and integrated device
- Publication number 20050001324
- Publication date Jan 6, 2005
- MOTOROLA, INC.
- Gregory J. Dunn
- G01 - MEASURING TESTING
Information Patent Application
Low cost fabrication and assembly of lid for semiconductor devices
- Publication number 20040087053
- Publication date May 6, 2004
- MOTOROLA INC.
- William H. Lytle
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Wafer level MEMS packaging
- Publication number 20030230798
- Publication date Dec 18, 2003
- Jong-Kai Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY

William H. Lytle

Person

Patents Grantslast 30 patents

Method for singulating electronic components from a substrate

Warp compensated electronic assemblies

Warp compensated package and method

Method of forming a semiconductor package including two devices

Method for releasing a microelectronic assembly from a carrier subs...

Flexible carrier for high volume electronic package fabrication

Method for forming a packaged semiconductor device

Method of forming a package with exposed component surfaces

Electronic assembly manufacturing method

Integrated circuit package formation

Method of packaging an integrated circuit die

Flexible carrier and release method for high volume electronic pack...

Corrosion-resistant copper bond pad and integrated device

Activation plate for electroless and immersion plating of integrate...

Wafer level MEMS packaging

Low cost fabrication and assembly of lid for semiconductor devices

Apparatus and method for cold cross-sectioning of soft materials

Bonding structure for an electronic device

Method of forming an electrically conductive polymer bump over an a...

Method of forming contact pads for wafer level testing and burn-in...

Method of forming an electrical interconnect

Interconnect system for a semiconductor chip and a substrate

Method of etching copper layers

Adjustable plating cell for uniform bump plating of semiconductor w...

Device for solder removal

Electroless plating of portions of semiconductor devices and the like

Backside metallization scheme for semiconductor devices

Method of chemically etching TiW and/or TiWN

Patents Applicationslast 30 patents

WARP COMPENSATED ELECTRONIC ASSEMBLIES

METHOD FOR SINGULATING ELECTRONIC COMPONENTS FROM A SUBSTRATE

METHOD AND SYSTEM FOR RELEASING A MICROELECTRONIC ASSEMBLY FROM A C...

INTEGRATED CIRCUIT PACKAGE FORMATION

METHOD OF FORMING A PACKAGE WITH EXPOSED COMPONENT SURFACES

ELECTRONIC ASSEMBLY MANUFACTURING METHOD

METHOD OF PACKAGING AN INTEGRATED CIRCUIT DIE

INTERCONNECT IN A MULTI-ELEMENT PACKAGE

FLEXIBLE CARRIER FOR HIGH VOLUME ELECTRONIC PACKAGE FABRICATION

METHOD FOR FORMING A MICROELECTRONIC ASSEMBLY INCLUDING ENCAPSULATI...

Warp compensated package and method

Flexible carrier and release method for high volume electronic pack...

Corrosion-resistant bond pad and integrated device

Activation plate for electroless and immersion plating of integrate...

Corrosion-resistant bond pad and integrated device

Corrosion-resistant copper bond pad and integrated device

Low cost fabrication and assembly of lid for semiconductor devices

Wafer level MEMS packaging