William H. McClintock

Person

Los Altos, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Integrating 3D printing into multi-process fabrication schemes
- Patent number 11,241,839
- Issue date Feb 8, 2022
- Applied Materials, Inc.
- William H. McClintock
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Substrate features for inductive monitoring of conductive trench depth
- Patent number 10,199,281
- Issue date Feb 5, 2019
- Applied Materials, Inc.
- Wei Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate features for inductive monitoring of conductive trench depth
- Patent number 9,911,664
- Issue date Mar 6, 2018
- Applied Materials, Inc.
- Wei Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemical planarization of copper wafer polishing
- Patent number 8,586,481
- Issue date Nov 19, 2013
- Applied Materials, Inc.
- You Wang
- B24 - GRINDING POLISHING
Information Patent Grant
Composite removable hardmask
- Patent number 8,252,699
- Issue date Aug 28, 2012
- Applied Materials, Inc.
- Anthony Konecni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of thin film process
- Patent number 7,939,422
- Issue date May 10, 2011
- Applied Materials, Inc.
- Nitin K. Ingle
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATING 3D PRINTING INTO MULTI-PROCESS FABRICATION SCHEMES
- Publication number 20190299537
- Publication date Oct 3, 2019
- Applied Materials, Inc.
- William H. MCCLINTOCK
- G01 - MEASURING TESTING
Information Patent Application
SUBSTRATE FEATURES FOR INDUCTIVE MONITORING OF CONDUCTIVE TRENCH DEPTH
- Publication number 20180166347
- Publication date Jun 14, 2018
- Applied Materials, Inc.
- Wei Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MONITORING OF POLISHING PAD THICKNESS FOR CHEMICAL MECHANICAL POLIS...
- Publication number 20180056476
- Publication date Mar 1, 2018
- Applied Materials, Inc.
- Jimin Zhang
- G01 - MEASURING TESTING
Information Patent Application
SUBSTRATE FEATURES FOR INDUCTIVE MONITORING OF CONDUCTIVE TRENCH DEPTH
- Publication number 20150371907
- Publication date Dec 24, 2015
- Applied Materials, Inc.
- Wei Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
In-Sequence Spectrographic Sensor
- Publication number 20140141694
- Publication date May 22, 2014
- Applied Materials, Inc.
- Jimin Zhang
- B24 - GRINDING POLISHING
Information Patent Application
ENGINEERING DIELECTRIC FILMS FOR CMP STOP
- Publication number 20130189841
- Publication date Jul 25, 2013
- Applied Materials, Inc.
- Mihaela Balseanu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE REMOVABLE HARDMASK
- Publication number 20120129351
- Publication date May 24, 2012
- Applied Materials, Inc.
- Anthony Konecni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMICAL PLANARIZATION OF COPPER WAFER POLISHING
- Publication number 20110294293
- Publication date Dec 1, 2011
- Applied Materials, Inc.
- You Wang
- B24 - GRINDING POLISHING
Information Patent Application
METHODS OF THIN FILM PROCESS
- Publication number 20110151676
- Publication date Jun 23, 2011
- Applied Materials, Inc.
- Nitin K. Ingle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR CRITICAL DIMENSION SHRINK USING CONFORMAL PECVD FILMS
- Publication number 20090286402
- Publication date Nov 19, 2009
- Applied Materials, Inc.
- Li-Qun Xia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF THIN FILM PROCESS
- Publication number 20080182382
- Publication date Jul 31, 2008
- Applied Materials, Inc.
- Nitin K. Ingle
- H01 - BASIC ELECTRIC ELEMENTS

William H. McClintock

Person

Patents Grantslast 30 patents

Integrating 3D printing into multi-process fabrication schemes

Substrate features for inductive monitoring of conductive trench depth

Substrate features for inductive monitoring of conductive trench depth

Chemical planarization of copper wafer polishing

Composite removable hardmask

Methods of thin film process

Patents Applicationslast 30 patents

INTEGRATING 3D PRINTING INTO MULTI-PROCESS FABRICATION SCHEMES

SUBSTRATE FEATURES FOR INDUCTIVE MONITORING OF CONDUCTIVE TRENCH DEPTH

MONITORING OF POLISHING PAD THICKNESS FOR CHEMICAL MECHANICAL POLIS...

SUBSTRATE FEATURES FOR INDUCTIVE MONITORING OF CONDUCTIVE TRENCH DEPTH

In-Sequence Spectrographic Sensor

ENGINEERING DIELECTRIC FILMS FOR CMP STOP

COMPOSITE REMOVABLE HARDMASK

CHEMICAL PLANARIZATION OF COPPER WAFER POLISHING

METHODS OF THIN FILM PROCESS

METHOD FOR CRITICAL DIMENSION SHRINK USING CONFORMAL PECVD FILMS

METHODS OF THIN FILM PROCESS