William H. Price

Person

E. Rockaway, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Corrosion-free multi-layer conductor
- Patent number 6,203,926
- Issue date Mar 20, 2001
- International Business Machines Corporation
- Umar Moez Uddin Ahmad
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Robust interconnect structure
- Patent number 6,133,136
- Issue date Oct 17, 2000
- International Business Machines Corporation
- Daniel Charles Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module input-output pad having stepped set-back
- Patent number 5,483,105
- Issue date Jan 9, 1996
- International Business Machines Corporation
- Suryanarayana Kaja
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for corrosion free multi-layer metal conductors
- Patent number 5,427,983
- Issue date Jun 27, 1995
- International Business Machines Corporation
- Umar M. U. Ahmad
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for forming distributed barrier compound semiconductor contacts
- Patent number 5,098,859
- Issue date Mar 24, 1992
- International Business Machines Corporation
- Thomas N. Jackson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally stable low resistance contact
- Patent number 4,849,802
- Issue date Jul 18, 1989
- IBM Corporation
- Thomas N. Jackson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally stable ohmic contact for gallium-arsenide
- Patent number 4,796,082
- Issue date Jan 3, 1989
- International Business Machines Corporation
- Masanori Murakami
- H01 - BASIC ELECTRIC ELEMENTS

William H. Price

Person

Patents Grantslast 30 patents

Corrosion-free multi-layer conductor

Robust interconnect structure

Module input-output pad having stepped set-back

Process for corrosion free multi-layer metal conductors

Method for forming distributed barrier compound semiconductor contacts

Thermally stable low resistance contact

Thermally stable ohmic contact for gallium-arsenide