William Infantolino

Person

Vestal, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Electronic package with optimized circuitization pattern
- Patent number 7,088,008
- Issue date Aug 8, 2006
- International Business Machines Corporation
- David J. Alcoe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and packaging structure for optimizing warpage of flip chip...
- Patent number 7,026,706
- Issue date Apr 11, 2006
- International Business Machines Corporation
- William Infantolino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer with semiconductor chips mounted thereon
- Patent number 6,967,389
- Issue date Nov 22, 2005
- International Business Machines Corporation
- William Infantolino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Land grid array stiffener for use with flexible chip carriers
- Patent number 6,905,961
- Issue date Jun 14, 2005
- International Business Machines Corporation
- David Vincent Caletka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip module and method of manufacture of same
- Patent number 6,759,270
- Issue date Jul 6, 2004
- International Buisness Machines Corporation
- William Infantolino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip module and method of manufacture of same
- Patent number 6,756,662
- Issue date Jun 29, 2004
- International Business Machines Corporation
- William Infantolino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and packaging structure for optimizing warpage of flip chip...
- Patent number 6,747,331
- Issue date Jun 8, 2004
- International Business Machines Corporation
- William Infantolino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Land grid array stiffener use with flexible chip carriers
- Patent number 6,528,892
- Issue date Mar 4, 2003
- International Business Machines Corporation
- David Vincent Caletka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual purpose ribbon cable
- Patent number 6,433,283
- Issue date Aug 13, 2002
- International Business Machines Corporation
- William L. Brodsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual purpose ribbon cable
- Patent number 6,268,567
- Issue date Jul 31, 2001
- International Business Machines Corporation
- William L. Brodsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for pressing an electronic card against contacts of a tes...
- Patent number 6,014,031
- Issue date Jan 11, 2000
- International Business Machines Corporation
- William Infantolino
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
Chip carrier with optimized circuitization pattern
- Publication number 20040183211
- Publication date Sep 23, 2004
- International Business Machines Corporation
- David J. Alcoe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and packaging structure for optimizing warpage of flip chip...
- Publication number 20040155339
- Publication date Aug 12, 2004
- International Business Machines Corporation
- William Infantolino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer with semiconductor chips mounted thereon
- Publication number 20040135245
- Publication date Jul 15, 2004
- International Business Machines Corporation
- William Infantolino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor chip module and method of manufacture of same
- Publication number 20040058474
- Publication date Mar 25, 2004
- International Business Machines Corporation
- William Infantolino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP MODULE AND METHOD OF MANUFACTURE OF SAME
- Publication number 20040056347
- Publication date Mar 25, 2004
- International Business Machines Corporation
- William Infantolino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and packaging structure for optimizing warpage of flip chip...
- Publication number 20040012086
- Publication date Jan 22, 2004
- International Business Machines Corporation
- William Infantolino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Land grid array stiffener for use with flexible chip carriers
- Publication number 20030090000
- Publication date May 15, 2003
- David Vincent Caletka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Land grid array stiffener use with flexible chip carriers
- Publication number 20020180061
- Publication date Dec 5, 2002
- INTERNATIONAL BUSINESS MACHINES CORPORATION
- David Vincent Caletka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dual purpose ribbon cable
- Publication number 20010020541
- Publication date Sep 13, 2001
- William L. Brodsky
- H01 - BASIC ELECTRIC ELEMENTS

William Infantolino

Person

Patents Grantslast 30 patents

Electronic package with optimized circuitization pattern

Method and packaging structure for optimizing warpage of flip chip...

Wafer with semiconductor chips mounted thereon

Land grid array stiffener for use with flexible chip carriers

Semiconductor chip module and method of manufacture of same

Semiconductor chip module and method of manufacture of same

Method and packaging structure for optimizing warpage of flip chip...

Land grid array stiffener use with flexible chip carriers

Dual purpose ribbon cable

Dual purpose ribbon cable

Apparatus for pressing an electronic card against contacts of a tes...

Patents Applicationslast 30 patents

Chip carrier with optimized circuitization pattern

Method and packaging structure for optimizing warpage of flip chip...

Wafer with semiconductor chips mounted thereon

Semiconductor chip module and method of manufacture of same

SEMICONDUCTOR CHIP MODULE AND METHOD OF MANUFACTURE OF SAME

Method and packaging structure for optimizing warpage of flip chip...

Land grid array stiffener for use with flexible chip carriers

Land grid array stiffener use with flexible chip carriers

Dual purpose ribbon cable