William J. Maxwell

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Carollton, TX, US

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor chip package with spring biased lid
- Patent number 11,631,624
- Issue date Apr 18, 2023
- Advanced Micro Devices, Inc.
- Kaushik Mysore Srinivasa Setty
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR CHIP PACKAGE WITH SPRING BIASED LID
- Publication number 20200185294
- Publication date Jun 11, 2020
- ADVANCED MICRO DEVICES, INC.
- Kaushik Mysore Srinivasa Setty
- H01 - BASIC ELECTRIC ELEMENTS