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William J. Nestork
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Wappingers Falls, NY, US
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last 30 patents
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Patent Grant
Three-dimensional semiconductor structures formed from planar layers
Patent number
5,160,987
Issue date
Nov 3, 1992
International Business Machines Corporation
Wilber D. Pricer
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Power distribution for full wafer package
Patent number
4,899,208
Issue date
Feb 6, 1990
International Business Machines Corporation
Hans E. Dietsch
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Personalizable masterslice substrate for semiconductor chips
Patent number
4,602,271
Issue date
Jul 22, 1986
International Business Machines Corporation
William E. Dougherty
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Process for fabricating devices having dielectric isolation utilizi...
Patent number
3,954,523
Issue date
May 4, 1976
International Business Machines Corporation
Ingrid E. Magdo
H01 - BASIC ELECTRIC ELEMENTS