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William J. Palmteer
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N. Andover, MA, US
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Patents Grants
last 30 patents
Information
Patent Grant
Surface mount package
Patent number
7,595,453
Issue date
Sep 29, 2009
M/A-COM Technology Solutions Holdings, Inc.
William Palmteer
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Surface mount package for a high power light emitting diode
Patent number
7,157,744
Issue date
Jan 2, 2007
M/A-COM, Inc.
William J. Palmteer
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Leadframe-based chip scale package
Patent number
7,034,382
Issue date
Apr 25, 2006
M/A-COM, Inc.
William James Palmteer
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Solder-coated articles useful for substrate attachment
Patent number
6,781,065
Issue date
Aug 24, 2004
The Whitaker Corporation
William James Palmteer
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Printed circuit board (PCB)
Patent number
6,414,246
Issue date
Jul 2, 2002
Tyco Electronics Corporation
William J. Palmteer
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
SURFACE MOUNT PACKAGE
Publication number
20100018047
Publication date
Jan 28, 2010
William Palmteer
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Surface mount package
Publication number
20060266546
Publication date
Nov 30, 2006
M/A-COM, Inc.
William Palmteer
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Surface mount package for a high power light emitting diode
Publication number
20050093116
Publication date
May 5, 2005
M/A Com, Inc.
William J. Palmteer
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
RF termination device
Publication number
20030016092
Publication date
Jan 23, 2003
William J. Palmteer
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Leadframe-based chip scale package
Publication number
20020149091
Publication date
Oct 17, 2002
William James Palmteer
H01 - BASIC ELECTRIC ELEMENTS