William J. Reeder

Person

Boise, ID, US

People

Patents Grantslast 30 patents

Information Patent Grant
Chilled wafer dicing
- Patent number 7,767,557
- Issue date Aug 3, 2010
- Micron Technology, Inc.
- William Jeffery Reeder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing microelectronic imaging units with discret...
- Patent number 7,416,913
- Issue date Aug 26, 2008
- Micron Technology, Inc.
- Frank L. Hall
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic imaging units and methods of manufacturing microele...
- Patent number 7,417,294
- Issue date Aug 26, 2008
- Micron Technology, Inc.
- Frank L. Hall
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alignment and orientation features for a semiconductor package
- Patent number 7,229,905
- Issue date Jun 12, 2007
- Micron Technology, Inc.
- Stuart L. Roberts
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thick solder mask for confining encapsulant material over selected...
- Patent number 7,138,724
- Issue date Nov 21, 2006
- Micron Technology, Inc.
- Ford B. Grigg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of encapsulating selected locations of a semiconductor die...
- Patent number 7,125,748
- Issue date Oct 24, 2006
- Micron Technology, Inc.
- Ford B. Grigg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of encapsulating selected locations of a semiconductor die...
- Patent number 6,984,545
- Issue date Jan 10, 2006
- Micron Technology, Inc.
- Ford B. Grigg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alignment and orientation features for a semiconductor package
- Patent number 6,869,869
- Issue date Mar 22, 2005
- Micron Technology, Inc.
- Stuart L. Roberts
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alignment and orientation features for a semiconductor package
- Patent number 6,577,019
- Issue date Jun 10, 2003
- Micron Technology, Inc.
- Stuart L. Roberts
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder ball landpad design to improve laminate performance
- Patent number 6,577,004
- Issue date Jun 10, 2003
- Micron Technology, Inc.
- Brad D. Rumsey
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CHILLED WAFER DICING
- Publication number 20080280423
- Publication date Nov 13, 2008
- William Jeffery Reeder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Microelectronic imaging units and methods of manufacturing microele...
- Publication number 20070117249
- Publication date May 24, 2007
- Frank L. Hall
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solder masks used in encapsulation, assemblies including the solar...
- Publication number 20060205117
- Publication date Sep 14, 2006
- Ford B. Grigg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Microelectronic imaging units and methods of manufacturing microele...
- Publication number 20060014313
- Publication date Jan 19, 2006
- Frank L. Hall
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of encapsulating selected locations of a semiconductor die...
- Publication number 20050181545
- Publication date Aug 18, 2005
- Ford B. Grigg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Alignment and orientation features for a semiconductor package
- Publication number 20050148116
- Publication date Jul 7, 2005
- Stuart L. Roberts
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thick solder mask for confining encapsulant material over selected...
- Publication number 20040080027
- Publication date Apr 29, 2004
- Ford B. Grigg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thick solder mask for confining encapsulant material over selected...
- Publication number 20040014255
- Publication date Jan 22, 2004
- Ford B. Grigg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Alignment and orientation features for a semiconductor package
- Publication number 20030205795
- Publication date Nov 6, 2003
- Stuart L. Roberts
- H01 - BASIC ELECTRIC ELEMENTS

William J. Reeder

Person

Patents Grantslast 30 patents

Chilled wafer dicing

Methods of manufacturing microelectronic imaging units with discret...

Microelectronic imaging units and methods of manufacturing microele...

Alignment and orientation features for a semiconductor package

Thick solder mask for confining encapsulant material over selected...

Methods of encapsulating selected locations of a semiconductor die...

Methods of encapsulating selected locations of a semiconductor die...

Alignment and orientation features for a semiconductor package

Alignment and orientation features for a semiconductor package

Solder ball landpad design to improve laminate performance

Patents Applicationslast 30 patents

CHILLED WAFER DICING

Microelectronic imaging units and methods of manufacturing microele...

Solder masks used in encapsulation, assemblies including the solar...

Microelectronic imaging units and methods of manufacturing microele...

Methods of encapsulating selected locations of a semiconductor die...

Alignment and orientation features for a semiconductor package

Thick solder mask for confining encapsulant material over selected...

Thick solder mask for confining encapsulant material over selected...

Alignment and orientation features for a semiconductor package