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William K. Shu
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Sunnyvale, CA, US
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last 30 patents
Information
Patent Grant
Die pad crack absorption system and method for integrated circuit c...
Patent number
6,503,820
Issue date
Jan 7, 2003
Koninklijke Philips Electronics N.V.
William Kuang-Hua Shu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Staggered pad array
Patent number
6,037,669
Issue date
Mar 14, 2000
VLSI Technology, Inc.
William K. Shu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Composite metallization structures for improved post bonding reliab...
Patent number
6,020,647
Issue date
Feb 1, 2000
VLSI Technology, Inc.
Stephen L. Skala
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Universal test die and method for fine pad pitch designs
Patent number
5,675,179
Issue date
Oct 7, 1997
VLSI Technology, Inc.
William K. Shu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electrically and thermally enhanced package using a separate silico...
Patent number
5,598,031
Issue date
Jan 28, 1997
VLSI Technology, Inc.
Richard L. Groover
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of packing an IC die in a molded plastic employing an ultra-...
Patent number
5,525,839
Issue date
Jun 11, 1996
VLSI Technology, Inc.
William K. Shu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi-purpose bond pad test die
Patent number
5,153,507
Issue date
Oct 6, 1992
VLSI Technology, Inc.
Carl H. Fong
G01 - MEASURING TESTING