TREA

William Lap Keung Chow

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  • Hong Kong, HK
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Patents Grantslast 30 patents

  • Information Patent Grant

    Thin ball grid array package
    • Patent number 7,439,099
    • Issue date Oct 21, 2008
    • ASAT Ltd.
    • Chun Ho Fan
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Premolded cavity IC package
    • Patent number 6,841,859
    • Issue date Jan 11, 2005
    • ASAT Ltd.
    • Labeeb Sadak Thamby
    • H01 - BASIC ELECTRIC ELEMENTS