William Lu

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Tai-Ping, TW

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Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing interconnect
- Patent number 6,218,294
- Issue date Apr 17, 2001
- United Microelectronics Corp.
- Chien-Chih Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a shallow trench isolation structure
- Patent number 6,190,999
- Issue date Feb 20, 2001
- United Semiconductor Corp.
- Tsung-Yuan Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a shallow trench isolation
- Patent number 6,133,114
- Issue date Oct 17, 2000
- United Semiconductor Corp.
- William Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a via
- Patent number 6,100,183
- Issue date Aug 8, 2000
- United Semiconductor Corp.
- William Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a via with plasma treatment of SOG
- Patent number 6,074,941
- Issue date Jun 13, 2000
- United Semiconductor Corp.
- Ching-Hsing Hsieh
- H01 - BASIC ELECTRIC ELEMENTS