William M. Beckenbaugh

Person

East Amwell Township, Hunterdon County, NJ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Methods of depositing metallic copper on substrates
- Patent number 4,304,849
- Issue date Dec 8, 1981
- Western Electric Co., Inc.
- William M. Beckenbaugh
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for depositing a metal on a surface
- Patent number 4,268,536
- Issue date May 19, 1981
- Western Electric Company, Inc.
- William M. Beckenbaugh
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of selectively depositing a metal on a surface of a substrate
- Patent number 4,261,800
- Issue date Apr 14, 1981
- Western Electric Co., Inc.
- William M. Beckenbaugh
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of depositing a stress-free electroless copper deposit
- Patent number 4,228,213
- Issue date Oct 14, 1980
- Western Electric Company, Inc.
- William M. Beckenbaugh
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of depositing a metal on a surface
- Patent number 4,181,750
- Issue date Jan 1, 1980
- Western Electric Company, Inc.
- William M. Beckenbaugh
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of depositing a stress-free electroless copper deposit
- Patent number 4,167,601
- Issue date Sep 11, 1979
- Western Electric Company, Inc.
- William M. Beckenbaugh
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

William M. Beckenbaugh

Person

Patents Grantslast 30 patents

Methods of depositing metallic copper on substrates

Method for depositing a metal on a surface

Method of selectively depositing a metal on a surface of a substrate

Method of depositing a stress-free electroless copper deposit

Method of depositing a metal on a surface

Method of depositing a stress-free electroless copper deposit