William M. Beckenbaugh

Person

Barrington, IL, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method for forming a microelectronic assembly
- Patent number 5,848,466
- Issue date Dec 15, 1998
- Motorola, Inc.
- Daniel Joseph Viza
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming contact pads for wafer level testing and burn-in...
- Patent number 5,593,903
- Issue date Jan 14, 1997
- Motorola, Inc.
- William M. Beckenbaugh
- G01 - MEASURING TESTING
Information Patent Grant
Tin bismuth solder paste, and method using paste to form connection...
- Patent number 5,429,292
- Issue date Jul 4, 1995
- Motorola, Inc.
- Cynthia M. Melton
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Tin bismuth solder paste, and method using paste to form connection...
- Patent number 5,389,160
- Issue date Feb 14, 1995
- Motorola, Inc.
- Cynthia M. Melton
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Liquid crystal display device with pixel registration illumination
- Patent number 5,377,027
- Issue date Dec 27, 1994
- Motorola, Inc.
- Kevin W. Jelley
- G02 - OPTICS
Information Patent Grant
Low temperature-wetting tin-base solder paste
- Patent number 5,229,070
- Issue date Jul 20, 1993
- Motorola, Inc.
- Cynthia M. Melton
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder plate reflow method for forming solder-bumped terminals
- Patent number 5,194,137
- Issue date Mar 16, 1993
- Motorola Inc.
- Kevin D. Moore
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder plate reflow method for forming a solder bump on a circuit t...
- Patent number 5,160,409
- Issue date Nov 3, 1992
- Motorola, Inc.
- Kevin D. Moore
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Palladium-coated solder ball
- Patent number 5,086,966
- Issue date Feb 11, 1992
- Motorola Inc.
- Cynthia M. Melton
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

William M. Beckenbaugh

Person

Patents Grantslast 30 patents

Method for forming a microelectronic assembly

Method of forming contact pads for wafer level testing and burn-in...

Tin bismuth solder paste, and method using paste to form connection...

Tin bismuth solder paste, and method using paste to form connection...

Liquid crystal display device with pixel registration illumination

Low temperature-wetting tin-base solder paste

Solder plate reflow method for forming solder-bumped terminals

Solder plate reflow method for forming a solder bump on a circuit t...

Palladium-coated solder ball