William M. Williams

Person

Gilbert, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit with test pad structure and method of testing
- Patent number 6,937,047
- Issue date Aug 30, 2005
- FREESCALE SEMICONDUCTOR, INC.
- Tu-Anh Tran
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor wafer contact system and method for contacting a semi...
- Patent number 5,773,986
- Issue date Jun 30, 1998
- Motorola, Inc.
- Patrick F. Thompson
- G01 - MEASURING TESTING
Information Patent Grant
Process for electrically connecting electrical devices using a cond...
- Patent number 5,661,042
- Issue date Aug 26, 1997
- Motorola, Inc.
- Treliant Fang
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor wafer contact system and method for contacting a semi...
- Patent number 5,629,630
- Issue date May 13, 1997
- Motorola, Inc.
- Patrick F. Thompson
- G01 - MEASURING TESTING
Information Patent Grant
Integrated circuit testing board having constrained thermal expansi...
- Patent number 5,602,491
- Issue date Feb 11, 1997
- Motorola, Inc.
- Barbara Vasquez
- G01 - MEASURING TESTING
Information Patent Grant
Method for aligning a semiconductor device
- Patent number 5,556,808
- Issue date Sep 17, 1996
- Motorola Inc.
- William M. Williams
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit test system
- Patent number 5,469,072
- Issue date Nov 21, 1995
- Motorola, Inc.
- William M. Williams
- G01 - MEASURING TESTING
Information Patent Grant
Method for electrically testing a semiconductor die using a test ap...
- Patent number 5,330,919
- Issue date Jul 19, 1994
- Motorola, Inc.
- Gregory L. Westbrook
- G01 - MEASURING TESTING
Information Patent Grant
Test contact fixture using flexible circuit tape
- Patent number 5,087,877
- Issue date Feb 11, 1992
- Motorola Inc.
- Dieter Frentz
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
Integrated circuit with test pad structure and method of testing
- Publication number 20050030055
- Publication date Feb 10, 2005
- Tu-Anh Tran
- G01 - MEASURING TESTING

William M. Williams

Person

Patents Grantslast 30 patents

Integrated circuit with test pad structure and method of testing

Semiconductor wafer contact system and method for contacting a semi...

Process for electrically connecting electrical devices using a cond...

Semiconductor wafer contact system and method for contacting a semi...

Integrated circuit testing board having constrained thermal expansi...

Method for aligning a semiconductor device

Integrated circuit test system

Method for electrically testing a semiconductor die using a test ap...

Test contact fixture using flexible circuit tape

Patents Applicationslast 30 patents

Integrated circuit with test pad structure and method of testing