William R. Fewer

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West Covina, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Microbeam assembly and associated method for integrated circuit int...
- Patent number 6,405,429
- Issue date Jun 18, 2002
- Honeywell Inc.
- John Whittier Slemmons
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for supporting during fabrication mechanical members of semi...
- Patent number 6,297,069
- Issue date Oct 2, 2001
- Honeywell Inc.
- Pierino Italo Zappella
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Transferable solder bumps for interconnect and assembly of MCM subs...
- Patent number 5,440,239
- Issue date Aug 8, 1995
- Rockwell International Corporation
- Pierino I. Zappella
- G01 - MEASURING TESTING
Information Patent Grant
Method of forming detector array contact bumps for improved lift of...
- Patent number 5,091,288
- Issue date Feb 25, 1992
- Rockwell International Corporation
- Pierino I. Zappella
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Method and apparatus for thermally stabilizing workpieces
- Patent number 4,139,051
- Issue date Feb 13, 1979
- Rockwell International Corporation
- Addison B. Jones
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
Microbeam assembly and associated method for integrated circuit int...
- Publication number 20050048696
- Publication date Mar 3, 2005
- Honeywell, Inc.
- John Whittier Slemmons
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Microbeam assembly for integrated circuit interconnection to substr...
- Publication number 20020036100
- Publication date Mar 28, 2002
- Honeywell, Inc.
- John Whittier Slemmons
- H01 - BASIC ELECTRIC ELEMENTS