William R. Stephenson

Person

Nampa, ID, US

People

Patents Grantslast 30 patents

Information Patent Grant
Stacked semiconductor die assemblies with high efficiency thermal p...
- Patent number 11,239,095
- Issue date Feb 1, 2022
- Micron Technology, Inc.
- David R. Hembree
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor die assemblies with high efficiency thermal p...
- Patent number 10,424,495
- Issue date Sep 24, 2019
- Micron Technology, Inc.
- David R. Hembree
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and packages and methods of forming semicondu...
- Patent number 10,083,937
- Issue date Sep 25, 2018
- Micron Technology, Inc.
- Anthony D. Veches
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor die assemblies with high efficiency thermal p...
- Patent number 10,008,395
- Issue date Jun 26, 2018
- Micron Technology, Inc.
- David R. Hembree
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and packages
- Patent number 9,502,369
- Issue date Nov 22, 2016
- Micron Technology, Inc.
- Anthony D. Veches
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for coupling a flowable conductive material to microelectro...
- Patent number 6,995,026
- Issue date Feb 7, 2006
- Micron Technology, Inc.
- Stephen Moxham
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Microelectronic assemblies and electronic devices including connect...
- Patent number 6,936,916
- Issue date Aug 30, 2005
- Micron Technology, Inc.
- Stephen Moxham
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of fabricating a molded ball grid array
- Patent number 6,916,683
- Issue date Jul 12, 2005
- Micron Technology, Inc.
- William R. Stephenson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for supporting microelectronic substrates
- Patent number 6,870,276
- Issue date Mar 22, 2005
- Micron Technology, Inc.
- Stephen Moxham
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Molded ball grid array
- Patent number 6,503,781
- Issue date Jan 7, 2003
- Micron Technology, Inc.
- William R. Stephenson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded ball grid array
- Patent number 6,400,574
- Issue date Jun 4, 2002
- Micron Technology, Inc.
- William R. Stephenson
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH HIGH EFFICIENCY THERMAL P...
- Publication number 20220157624
- Publication date May 19, 2022
- Micron Technology, Inc.
- David R. Hembree
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH HIGH EFFICIENCY THERMAL P...
- Publication number 20200020547
- Publication date Jan 16, 2020
- Micron Technology, Inc.
- David R. Hembree
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH HIGH EFFICIENCY THERMAL P...
- Publication number 20180294169
- Publication date Oct 11, 2018
- Micron Technology, Inc.
- David R. Hembree
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH HIGH EFFICIENCY THERMAL P...
- Publication number 20180108592
- Publication date Apr 19, 2018
- Micron Technology, Inc.
- David R. Hembree
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND PACKAGES AND METHODS OF FORMING SEMICONDU...
- Publication number 20170069603
- Publication date Mar 9, 2017
- Micron Technology, Inc.
- Anthony D. Veches
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND PACKAGES AND METHODS OF FORMING SEMICONDU...
- Publication number 20160225734
- Publication date Aug 4, 2016
- Micron Technology, Inc.
- Anthony D. Veches
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for supporting microelectronic substrates
- Publication number 20050242437
- Publication date Nov 3, 2005
- Micron Technology, Inc.
- Stephen Moxham
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Molded ball grid array
- Publication number 20050029554
- Publication date Feb 10, 2005
- William R. Stephenson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for coupling a flowable conductive material to microelectro...
- Publication number 20040159921
- Publication date Aug 19, 2004
- Stephen Moxham
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Microelectronic assemblies, electronic devices, and apparatuses for...
- Publication number 20040159946
- Publication date Aug 19, 2004
- Stephen Moxham
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Molded ball grid array
- Publication number 20020195708
- Publication date Dec 26, 2002
- William R. Stephenson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Molded ball grid array
- Publication number 20020121695
- Publication date Sep 5, 2002
- William R. Stephenson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Molded ball grid array
- Publication number 20010046724
- Publication date Nov 29, 2001
- William R. Stephenson
- H01 - BASIC ELECTRIC ELEMENTS

William R. Stephenson

Person

Patents Grantslast 30 patents

Stacked semiconductor die assemblies with high efficiency thermal p...

Stacked semiconductor die assemblies with high efficiency thermal p...

Semiconductor devices and packages and methods of forming semicondu...

Stacked semiconductor die assemblies with high efficiency thermal p...

Semiconductor devices and packages

Methods for coupling a flowable conductive material to microelectro...

Microelectronic assemblies and electronic devices including connect...

Methods of fabricating a molded ball grid array

Apparatus for supporting microelectronic substrates

Molded ball grid array

Molded ball grid array

Patents Applicationslast 30 patents

STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH HIGH EFFICIENCY THERMAL P...

STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH HIGH EFFICIENCY THERMAL P...

STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH HIGH EFFICIENCY THERMAL P...

STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH HIGH EFFICIENCY THERMAL P...

SEMICONDUCTOR DEVICES AND PACKAGES AND METHODS OF FORMING SEMICONDU...

SEMICONDUCTOR DEVICES AND PACKAGES AND METHODS OF FORMING SEMICONDU...

Method and apparatus for supporting microelectronic substrates

Molded ball grid array

Methods for coupling a flowable conductive material to microelectro...

Microelectronic assemblies, electronic devices, and apparatuses for...

Molded ball grid array

Molded ball grid array

Molded ball grid array