William S. Graupp

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Ft. Collins, CO, US

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Patents Grantslast 30 patents

Information Patent Grant
Trace design to minimize electromigration damage to solder bumps
- Patent number 7,253,528
- Issue date Aug 7, 2007
- Avago Technologies General IP Pte. Ltd.
- Walter John Dauksher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Routing design to minimize electromigration damage to solder bumps
- Patent number 7,208,843
- Issue date Apr 24, 2007
- Avago Technologies General IP (Singapore) Pte. Ltd.
- Wayne Patrick Richling
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Trace design to minimize electromigration damage to solder bumps
- Publication number 20060186539
- Publication date Aug 24, 2006
- Walter John Dauksher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Routing design to minimize electromigration damage to solder bumps
- Publication number 20060170100
- Publication date Aug 3, 2006
- Wayne Patrick Richling
- H01 - BASIC ELECTRIC ELEMENTS