William STONE

Person

San Diego, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Package comprising integrated devices coupled through a metallizati...
- Patent number 11,784,157
- Issue date Oct 10, 2023
- QUALCOMM Incorporated
- Li-Sheng Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit (IC) devices with varying diameter via layer
- Patent number 10,483,218
- Issue date Nov 19, 2019
- QUALCOMM Incorporated
- William Michael Stone
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit (IC) devices with varying diameter via layer
- Patent number 10,347,592
- Issue date Jul 9, 2019
- QUALCOMM Incorporated
- William Michael Stone
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package on package (PoP) device comprising thermal interface materi...
- Patent number 10,002,857
- Issue date Jun 19, 2018
- QUALCOMM Incorporated
- Michael James Solimando
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level package without sidewall cracking
- Patent number 9,318,405
- Issue date Apr 19, 2016
- QUALCOMM Incorporated
- Jianwen Xu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE COMPRISING A CHIPLET LOCATED BETWEEN AN INTEGRATED DEVICE A...
- Publication number 20240072032
- Publication date Feb 29, 2024
- QUALCOMM Incorporated
- Yanmei SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING A CHIPLET LOCATED BETWEEN TWO METALLIZATION PORT...
- Publication number 20240071993
- Publication date Feb 29, 2024
- QUALCOMM Incorporated
- Yanmei SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING INTEGRATED DEVICES COUPLED THROUGH A METALLIZATI...
- Publication number 20220392867
- Publication date Dec 8, 2022
- QUALCOMM Incorporated
- Li-Sheng WENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT (IC) PACKAGES EMPLOYING A CAPACITOR-EMBEDDED, RE...
- Publication number 20220344250
- Publication date Oct 27, 2022
- QUALCOMM Incorporated
- Jihong Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE CAVITY FOR ENHANCED DEVICE PERFORMANCE WITH AN INTEGRATED P...
- Publication number 20210375845
- Publication date Dec 2, 2021
- QUALCOMM Incorporated
- William Michael STONE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT (IC) DEVICES WITH VARYING DIAMETER VIA LAYER
- Publication number 20190287929
- Publication date Sep 19, 2019
- QUALCOMM Incorporated
- William Michael STONE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT (IC) DEVICES WITH VARYING DIAMETER VIA LAYER
- Publication number 20180151513
- Publication date May 31, 2018
- QUALCOMM Incorporated
- William Michael STONE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ON PACKAGE (PoP) DEVICE COMPRISING THERMAL INTERFACE MATERI...
- Publication number 20170294422
- Publication date Oct 12, 2017
- QUALCOMM Incorporated
- Michael James Solimando
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXPOSED DIE MOLD UNDERFILL (MUF) WITH FINE PITCH COPPER (CU) PILLAR...
- Publication number 20170271175
- Publication date Sep 21, 2017
- QUALCOMM Incorporated
- Christopher James HEALY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL PACKAGE AND FAN OUT RECONSTITUTION PROCESS FOR MAKING T...
- Publication number 20150318229
- Publication date Nov 5, 2015
- QUALCOMM Incorporated
- Jianwen XU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods and apparatus for applying changes to a group of objects
- Publication number 20070268057
- Publication date Nov 22, 2007
- Vandana Gopal
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

William STONE

Person

Patents Grantslast 30 patents

Package comprising integrated devices coupled through a metallizati...

Integrated circuit (IC) devices with varying diameter via layer

Integrated circuit (IC) devices with varying diameter via layer

Package on package (PoP) device comprising thermal interface materi...

Wafer level package without sidewall cracking

Patents Applicationslast 30 patents

PACKAGE COMPRISING A CHIPLET LOCATED BETWEEN AN INTEGRATED DEVICE A...

PACKAGE COMPRISING A CHIPLET LOCATED BETWEEN TWO METALLIZATION PORT...

PACKAGE COMPRISING INTEGRATED DEVICES COUPLED THROUGH A METALLIZATI...

INTEGRATED CIRCUIT (IC) PACKAGES EMPLOYING A CAPACITOR-EMBEDDED, RE...

PACKAGE CAVITY FOR ENHANCED DEVICE PERFORMANCE WITH AN INTEGRATED P...

INTEGRATED CIRCUIT (IC) DEVICES WITH VARYING DIAMETER VIA LAYER

INTEGRATED CIRCUIT (IC) DEVICES WITH VARYING DIAMETER VIA LAYER

PACKAGE ON PACKAGE (PoP) DEVICE COMPRISING THERMAL INTERFACE MATERI...

EXPOSED DIE MOLD UNDERFILL (MUF) WITH FINE PITCH COPPER (CU) PILLAR...

WAFER LEVEL PACKAGE AND FAN OUT RECONSTITUTION PROCESS FOR MAKING T...

Methods and apparatus for applying changes to a group of objects