William T. Chen

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Singapore, SG

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Patents Grantslast 30 patents

Information Patent Grant
Underfill preform interposer for joining chip to substrate
- Patent number 6,258,627
- Issue date Jul 10, 2001
- International Business Machines Corporation
- Joseph A. Benenati
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Area array stud bump flip chip device and assembly process
- Patent number 6,214,642
- Issue date Apr 10, 2001
- Institute of Materials Research and Engineering
- William T. Chen
- H01 - BASIC ELECTRIC ELEMENTS