William T. Glennan

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Folsom, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Die over mold stacked semiconductor package
- Patent number 11,948,917
- Issue date Apr 2, 2024
- Intel Corporation
- Florence Pon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package assembly with wire end above a topmost c...
- Patent number 9,978,722
- Issue date May 22, 2018
- Intel Corporation
- William T. Glennan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DIE OVER MOLD STACKED SEMICONDUCTOR PACKAGE
- Publication number 20200343221
- Publication date Oct 29, 2020
- Intel Corporation
- Florence PON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE ASSEMBLY WITH WIRE END ABOVE A TOPMOST C...
- Publication number 20180090468
- Publication date Mar 29, 2018
- Intel Corporation
- William T. Glennan
- H01 - BASIC ELECTRIC ELEMENTS