William T. LEE

Person

Dublin, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Interlevel conductor pre-fill utilizing selective barrier deposition
- Patent number 10,262,943
- Issue date Apr 16, 2019
- Lam Research Corporation
- Artur Kolics
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Interlevel conductor pre-fill utilizing selective barrier deposition
- Patent number 9,875,968
- Issue date Jan 23, 2018
- Lam Research Corporation
- Artur Kolics
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interlevel conductor pre-fill utilizing selective barrier deposition
- Patent number 9,583,386
- Issue date Feb 28, 2017
- Lam Research Corporation
- Artur Kolics
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Selective formation of dielectric barriers for metal interconnects...
- Patent number 9,418,889
- Issue date Aug 16, 2016
- Lam Research Corporation
- Thomas Weller Mountsier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plated metal hard mask for vertical NAND hole etch
- Patent number 9,184,060
- Issue date Nov 10, 2015
- Lam Research Corporation
- William T. Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices for metallization
- Patent number 9,006,893
- Issue date Apr 14, 2015
- Lam Research Corporation
- Artur Kolics
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electroless copper deposition with suppressor
- Patent number 8,828,863
- Issue date Sep 9, 2014
- Lam Research Corporation
- William T. Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect with self-formed barrier
- Patent number 8,673,779
- Issue date Mar 18, 2014
- Lam Research Corporation
- Hyungsuk A. Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods, devices, and materials for metallization
- Patent number 8,518,815
- Issue date Aug 27, 2013
- Lam Research Corporation
- Artur Kolics
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Interlevel Conductor Pre-Fill Utilizing Selective Barrier Deposition
- Publication number 20180151503
- Publication date May 31, 2018
- LAM RESEARCH CORPORATION
- Artur Kolics
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interlevel Conductor Pre-Fill Utilizing Selective Barrier Deposition
- Publication number 20170162512
- Publication date Jun 8, 2017
- LAM RESEARCH CORPORATION
- Artur Kolics
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interlevel Conductor Pre-Fill Utilizing Selective Barrier Deposition
- Publication number 20160118296
- Publication date Apr 28, 2016
- LAM RESEARCH CORPORATION
- Artur Kolics
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE FORMATION OF DIELECTRIC BARRIERS FOR METAL INTERCONNECTS...
- Publication number 20150380302
- Publication date Dec 31, 2015
- LAM RESEARCH CORPORATION
- Thomas Weller Mountsier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS, DEVICES, AND MATERIALS FOR METALLIZATION
- Publication number 20140054776
- Publication date Feb 27, 2014
- LAM RESEARCH CORPORATION
- Artur KOLICS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS, DEVICES, AND MATERIALS FOR METALLIZATION
- Publication number 20120007239
- Publication date Jan 12, 2012
- Artur Kolics
- H01 - BASIC ELECTRIC ELEMENTS

William T. LEE

Person

Patents Grantslast 30 patents

Interlevel conductor pre-fill utilizing selective barrier deposition

Interlevel conductor pre-fill utilizing selective barrier deposition

Interlevel conductor pre-fill utilizing selective barrier deposition

Selective formation of dielectric barriers for metal interconnects...

Plated metal hard mask for vertical NAND hole etch

Devices for metallization

Electroless copper deposition with suppressor

Interconnect with self-formed barrier

Methods, devices, and materials for metallization

Patents Applicationslast 30 patents

Interlevel Conductor Pre-Fill Utilizing Selective Barrier Deposition

Interlevel Conductor Pre-Fill Utilizing Selective Barrier Deposition

Interlevel Conductor Pre-Fill Utilizing Selective Barrier Deposition

SELECTIVE FORMATION OF DIELECTRIC BARRIERS FOR METAL INTERCONNECTS...

METHODS, DEVICES, AND MATERIALS FOR METALLIZATION

METHODS, DEVICES, AND MATERIALS FOR METALLIZATION