William T. Pulz

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Cary, NC, US

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Patents Grantslast 30 patents

Information Patent Grant
Polymer via plugs with high thermal integrity
- Patent number 10,020,244
- Issue date Jul 10, 2018
- Cree, Inc.
- Van Mieczkowski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level die attach metallization
- Patent number 9,536,783
- Issue date Jan 3, 2017
- Cree, Inc.
- Fabian Radulescu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level die attach metallization
- Patent number 8,970,010
- Issue date Mar 3, 2015
- Cree, Inc.
- Fabian Radulescu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
WAFER-LEVEL DIE ATTACH METALLIZATION
- Publication number 20150140806
- Publication date May 21, 2015
- Cree, Inc.
- Fabian Radulescu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL DIE ATTACH METALLIZATION
- Publication number 20140264868
- Publication date Sep 18, 2014
- Cree, Inc.
- Fabian Radulescu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA PLUGS
- Publication number 20130256841
- Publication date Oct 3, 2013
- Cree, Inc.
- Van Mieczkowski
- H01 - BASIC ELECTRIC ELEMENTS