William Thie

Person

Mountain View, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
High aspect ratio etch
- Patent number 9,997,364
- Issue date Jun 12, 2018
- Lam Research Corporation
- William Thie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for wafer electroless plating
- Patent number 9,287,110
- Issue date Mar 15, 2016
- Lam Research Corporation
- William Thie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Controlled ambient system for interface engineering
- Patent number 9,117,860
- Issue date Aug 25, 2015
- Lam Research Corporation
- John Boyd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for removing a metal oxide from a substrate
- Patent number 8,883,027
- Issue date Nov 11, 2014
- Lam Research Corporation
- Hyungsuk Alexander Yoon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fluid handling system for wafer electroless plating and associated...
- Patent number 8,844,461
- Issue date Sep 30, 2014
- Lam Research Corporation
- William Thie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Post-deposition cleaning methods for substrates with cap layers
- Patent number 8,790,465
- Issue date Jul 29, 2014
- Lam Research Corporation
- Artur Kolics
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Grant
Processes and systems for engineering a copper surface for selectiv...
- Patent number 8,771,804
- Issue date Jul 8, 2014
- Lam Research Corporation
- Yezdi Dordi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Processes and systems for engineering a silicon-type surface for se...
- Patent number 8,747,960
- Issue date Jun 10, 2014
- Lam Research Corporation
- Yezdi Dordi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Controlled gas mixing for smooth sidewall rapid alternating etch pr...
- Patent number 8,691,698
- Issue date Apr 8, 2014
- Lam Research Corporation
- Qing Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Simultaneous electroless plating of two substrates
- Patent number 8,622,020
- Issue date Jan 7, 2014
- Lam Research Corporation
- William Thie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Porous dielectrics K value restoration by thermal treatment and or...
- Patent number 8,603,913
- Issue date Dec 10, 2013
- Lam Research Corporation
- Nanhai Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for material deposition
- Patent number 8,490,573
- Issue date Jul 23, 2013
- Lam Research Corporation
- Yezdi Dordi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method and apparatus for wafer electroless plating
- Patent number 8,485,120
- Issue date Jul 16, 2013
- Lam Research Corporation
- William Thie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Post-deposition cleaning methods and formulations for substrates wi...
- Patent number 8,404,626
- Issue date Mar 26, 2013
- Lam Research Corporation
- Artur Kolics
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Grant
Wafer electroless plating system and associated methods
- Patent number 8,314,027
- Issue date Nov 20, 2012
- Lam Research Corporation
- William Thie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Processes and systems for engineering a barrier surface for copper...
- Patent number 8,241,701
- Issue date Aug 14, 2012
- Lam Research Corporation
- Yezdi Dordi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods and systems for barrier layer surface passivation
- Patent number 8,133,812
- Issue date Mar 13, 2012
- Lam Research Corporation
- Yezdi Dordi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Wafer electroless plating system and associated methods
- Patent number 8,069,813
- Issue date Dec 6, 2011
- Lam Research Corporation
- William Thie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Interconnect structure and method of manufacturing a damascene stru...
- Patent number 8,026,605
- Issue date Sep 27, 2011
- Lam Research Corporation
- Yezdi Dordi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Megasonic cleaning efficiency using auto-tuning of a RF generator a...
- Patent number 7,909,934
- Issue date Mar 22, 2011
- Lam Research Corporation
- John Boyd
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Grant
Thermal methods for cleaning post-CMP wafers
- Patent number 7,884,017
- Issue date Feb 8, 2011
- Lam Research Corporation
- Zhonghui Alex Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for electroless depositing a material on a surface of a wafer
- Patent number 7,875,554
- Issue date Jan 25, 2011
- Lam Research Corporation
- Yezdi Dordi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electroless plating method and apparatus
- Patent number 7,829,152
- Issue date Nov 9, 2010
- Lam Research Corporation
- William Thie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Apparatus for applying a plating solution for electroless deposition
- Patent number 7,752,996
- Issue date Jul 13, 2010
- Lam Research Corporation
- Yezdi Dordi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Thermal methods for cleaning post-CMP wafers
- Patent number 7,709,400
- Issue date May 4, 2010
- Lam Research Corporation
- Zhonghui Alex Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for the removal of a metal oxide from a substrate and met...
- Patent number 7,662,253
- Issue date Feb 16, 2010
- Lam Research Corporation
- Hyungsuk Alexander Yoon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods and systems for barrier layer surface passivation
- Patent number 7,592,259
- Issue date Sep 22, 2009
- Lam Research Corporation
- Yezdi Dordi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method and apparatus for semiconductor wafer planarization
- Patent number 7,582,565
- Issue date Sep 1, 2009
- Lam Research Corporation
- Fred C. Redeker
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method and apparatus for semiconductor wafer planarization
- Patent number 7,368,017
- Issue date May 6, 2008
- Lam Research Corporation
- Fred C. Redeker
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method and apparatus for material deposition in semiconductor fabri...
- Patent number 7,358,186
- Issue date Apr 15, 2008
- Lam Research Corporation
- Yezdi Dordi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
FLAT BOTTOM SHADOW RING
- Publication number 20230223292
- Publication date Jul 13, 2023
- LAM RESEARCH CORPORATION
- Lai Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LOCATION GAS INJECTION TO IMPROVE UNIFORMITY IN RAPID ALTERNA...
- Publication number 20220108875
- Publication date Apr 7, 2022
- LAM RESEARCH CORPORATION
- William THIE
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
HIGH ASPECT RATIO ETCH
- Publication number 20180108531
- Publication date Apr 19, 2018
- LAM RESEARCH CORPORATION
- William THIE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSES AND SYSTEMS FOR ENGINEERING A BARRIER SURFACE FOR COPPER...
- Publication number 20150214093
- Publication date Jul 30, 2015
- LAM RESEARCH CORPORATION
- Yezdi Dordi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR FORMING PATTERNED COPPER LINES THROUGH ELECTR...
- Publication number 20150034589
- Publication date Feb 5, 2015
- LAM RESEARCH CORPORATION
- Alan Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROCESSES AND SYSTEMS FOR ENGINEERING A COPPER SURFACE FOR SELECTIV...
- Publication number 20140322446
- Publication date Oct 30, 2014
- Yezdi Dordi
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
POST-DEPOSITION CLEANING METHODS AND FORMULATIONS FOR SUBSTRATES WI...
- Publication number 20130323410
- Publication date Dec 5, 2013
- LAM RESEARCH CORPORATION
- Artur KOLICS
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Application
Method and Apparatus for Wafer Electroless Plating
- Publication number 20130280917
- Publication date Oct 24, 2013
- William Thie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CONTROLLED GAS MIXING FOR SMOOTH SIDEWALL RAPID ALTERNATING ETCH PR...
- Publication number 20130203256
- Publication date Aug 8, 2013
- LAM RESEARCH CORPORATION
- Qing Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Processes and Systems for Engineering a Barrier Surface for Copper...
- Publication number 20120269987
- Publication date Oct 25, 2012
- LAM RESEARCH CORPORATION
- Yezdi Dordi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Wafer Electroless Plating System and Associated Methods
- Publication number 20120045897
- Publication date Feb 23, 2012
- LAM RESEARCH CORPORATION
- William Thie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
INTERCONNECT STRUCTURE AND METHOD OF MANUFACTURING A DAMASCENE STRU...
- Publication number 20110306203
- Publication date Dec 15, 2011
- LAM RESEARCH CORPORATION
- Yezdi Dordi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Apparatus for Material Deposition
- Publication number 20110081779
- Publication date Apr 7, 2011
- LAM RESEARCH CORPORATION
- Yezdi Dordi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Electroless Plating Method and Apparatus
- Publication number 20110011335
- Publication date Jan 20, 2011
- William Thie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Apparatus for Applying a Plating Solution for Electroless Deposition
- Publication number 20100239767
- Publication date Sep 23, 2010
- Yezdi Dordi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
THERMAL METHODS FOR CLEANING POST-CMP WAFERS
- Publication number 20100136788
- Publication date Jun 3, 2010
- LAM RESEARCH CORPORATION
- Zhonghui Alex Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR REMOVING A METAL OXIDE FROM A SUBSTRATE
- Publication number 20100108491
- Publication date May 6, 2010
- Hyungsuk Alexander Yoon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS AND SYSTEMS FOR BARRIER LAYER SURFACE PASSIVATION
- Publication number 20100009535
- Publication date Jan 14, 2010
- Yezdi Dordi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Self assembled monolayer for improving adhesion between copper and...
- Publication number 20090304914
- Publication date Dec 10, 2009
- LAM RESEARCH CORPORATION
- Praveen Nalla
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
POST-DEPOSITION CLEANING METHODS AND FORMULATIONS FOR SUBSTRATES WI...
- Publication number 20090162537
- Publication date Jun 25, 2009
- Artur KOLICS
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Thermal methods for cleaning post-CMP wafers
- Publication number 20080280456
- Publication date Nov 13, 2008
- Lam Research Corporation
- Zhonghui Alex Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fluid Handling System for Wafer Electroless Plating and Associated...
- Publication number 20080251148
- Publication date Oct 16, 2008
- LAM RESEARCH CORPORATION
- William Thie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Wafer Electroless Plating System and Associated Methods
- Publication number 20080254621
- Publication date Oct 16, 2008
- LAM RESEARCH CORPORATION
- William Thie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method and Apparatus for Wafer Electroless Plating
- Publication number 20080254225
- Publication date Oct 16, 2008
- LAM RESEARCH CORPORATION
- William Thie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method and Apparatus for Semiconductor Wafer Planarization
- Publication number 20080166885
- Publication date Jul 10, 2008
- LAM RESEARCH CORPORATION
- Fred C. Redeker
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Self-limiting plating method
- Publication number 20080152823
- Publication date Jun 26, 2008
- Lam Research Corporation
- John Boyd
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method and Apparatus for Material Deposition
- Publication number 20080153291
- Publication date Jun 26, 2008
- LAM RESEARCH CORPORATION
- Yezdi Dordi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Methods and systems for barrier layer surface passivation
- Publication number 20080146025
- Publication date Jun 19, 2008
- Yezdi Dordi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Interconnect structure and method of manufacturing a damascene stru...
- Publication number 20080142971
- Publication date Jun 19, 2008
- LAM RESEARCH CORPORATION
- Yezdi Dordi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROLESS PLATING METHOD AND APPARATUS
- Publication number 20080085370
- Publication date Apr 10, 2008
- William Thie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

William Thie

Person

Patents Grantslast 30 patents

High aspect ratio etch

Method and apparatus for wafer electroless plating

Controlled ambient system for interface engineering

Methods for removing a metal oxide from a substrate

Fluid handling system for wafer electroless plating and associated...

Post-deposition cleaning methods for substrates with cap layers

Processes and systems for engineering a copper surface for selectiv...

Processes and systems for engineering a silicon-type surface for se...

Controlled gas mixing for smooth sidewall rapid alternating etch pr...

Simultaneous electroless plating of two substrates

Porous dielectrics K value restoration by thermal treatment and or...

Method and apparatus for material deposition

Method and apparatus for wafer electroless plating

Post-deposition cleaning methods and formulations for substrates wi...

Wafer electroless plating system and associated methods

Processes and systems for engineering a barrier surface for copper...

Methods and systems for barrier layer surface passivation

Wafer electroless plating system and associated methods

Interconnect structure and method of manufacturing a damascene stru...

Megasonic cleaning efficiency using auto-tuning of a RF generator a...

Thermal methods for cleaning post-CMP wafers

Method for electroless depositing a material on a surface of a wafer

Electroless plating method and apparatus

Apparatus for applying a plating solution for electroless deposition

Thermal methods for cleaning post-CMP wafers

Apparatus for the removal of a metal oxide from a substrate and met...

Methods and systems for barrier layer surface passivation

Method and apparatus for semiconductor wafer planarization

Method and apparatus for semiconductor wafer planarization

Method and apparatus for material deposition in semiconductor fabri...

Patents Applicationslast 30 patents

FLAT BOTTOM SHADOW RING

MULTI-LOCATION GAS INJECTION TO IMPROVE UNIFORMITY IN RAPID ALTERNA...

HIGH ASPECT RATIO ETCH

PROCESSES AND SYSTEMS FOR ENGINEERING A BARRIER SURFACE FOR COPPER...

SYSTEM AND METHOD FOR FORMING PATTERNED COPPER LINES THROUGH ELECTR...

PROCESSES AND SYSTEMS FOR ENGINEERING A COPPER SURFACE FOR SELECTIV...

POST-DEPOSITION CLEANING METHODS AND FORMULATIONS FOR SUBSTRATES WI...

Method and Apparatus for Wafer Electroless Plating

CONTROLLED GAS MIXING FOR SMOOTH SIDEWALL RAPID ALTERNATING ETCH PR...

Processes and Systems for Engineering a Barrier Surface for Copper...

Wafer Electroless Plating System and Associated Methods

INTERCONNECT STRUCTURE AND METHOD OF MANUFACTURING A DAMASCENE STRU...

Method and Apparatus for Material Deposition

Electroless Plating Method and Apparatus

Apparatus for Applying a Plating Solution for Electroless Deposition

THERMAL METHODS FOR CLEANING POST-CMP WAFERS

METHODS FOR REMOVING A METAL OXIDE FROM A SUBSTRATE

METHODS AND SYSTEMS FOR BARRIER LAYER SURFACE PASSIVATION

Self assembled monolayer for improving adhesion between copper and...

POST-DEPOSITION CLEANING METHODS AND FORMULATIONS FOR SUBSTRATES WI...

Thermal methods for cleaning post-CMP wafers

Fluid Handling System for Wafer Electroless Plating and Associated...

Wafer Electroless Plating System and Associated Methods

Method and Apparatus for Wafer Electroless Plating

Method and Apparatus for Semiconductor Wafer Planarization

Self-limiting plating method

Method and Apparatus for Material Deposition

Methods and systems for barrier layer surface passivation

Interconnect structure and method of manufacturing a damascene stru...

ELECTROLESS PLATING METHOD AND APPARATUS